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Enhanced immersion cooling with flow diversion

A cooling device and immersion technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electrical components, etc., can solve problems such as heat source temperature soaring, chip burning, heat transfer deterioration, etc., to avoid gas-liquid retrograde, enhance supply The effect of liquid flow and enhanced heat transfer

Active Publication Date: 2020-01-17
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the immersion cooling device does not have special measures to curb or delay the occurrence of film boiling. If film boiling is formed, the heat transfer will be greatly deteriorated, and the temperature of the heat source will soar, which will often burn the chip and cause equipment loss.

Method used

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  • Enhanced immersion cooling with flow diversion
  • Enhanced immersion cooling with flow diversion
  • Enhanced immersion cooling with flow diversion

Examples

Experimental program
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Embodiment Construction

[0023] Such as figure 1 and figure 2 As shown, this embodiment includes: a housing 1, an insulating working medium 2, a condensing device, a deflector 4 and a component to be cooled 6, wherein: the component to be cooled 6 as a heat source and the condensing device as a cold source are respectively connected to the housing 1 connected, the deflector 4 is vertically arranged in the housing 1 and is not in contact with the heat source and the cold source, the ascending passage 7 and the return passage 8 of the insulating working fluid are formed between adjacent deflecting plates 4, and the insulating working fluid 2 It flows through the ascending channel 7 and the return channel 8 in the housing 1, forming a directional circulation in a closed space.

[0024] The housing 1 is made of aluminum alloy with high thermal conductivity.

[0025] The insulating working medium 2 is adopted but not limited to hydrofluoroether, preferably hydrofluoroether HFE7000.

[0026] Such as fi...

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Abstract

An enhanced immersion cooling device with a diversion function comprises a sealed casing, a deflector and an insulating working medium arranged in the casing, wherein the air deflector is vertically arranged in the shell, the air deflector is an ascending channel of the insulating working substance and a return channel of the insulating working substance is formed between the adjacent air deflector, the cold source and the heat source are respectively located above and below the shell, and the insulating working substance flows through the ascending channel and the return channel in the shellto form a directional circulation of an enclosed space. The directional cycle of the invention can enhance the liquid supply flow of the heat source, enhance heat exchange, and delay the appearance ofthe critical heat flux. The upward gas column or liquid column and downward liquid in different channels can effectively avoid gas-liquid retrogression, that is, the phenomenon of ascending bubbles entrapping downward liquid in the process of violent boiling does not occur, which reduces most of the flow resistance and is also conducive to the heat transfer of the device.

Description

technical field [0001] The invention relates to a technology in the field of electronic chips, in particular to an enhanced immersion cooling device with a flow guiding function. Background technique [0002] In recent years, the efficiency of processors has improved step by step, and the heat flow generated by electronic chips per unit area has also increased. If this part of the heat cannot be continuously and efficiently dissipated to the environment, the efficiency of the processor will be reduced, and the whole machine will be burned down. Therefore, the heat dissipation function of electronic products is the basic guarantee for the smooth operation of the entire product, and it is also a powerful driving force for improving product performance. Generally speaking, heat dissipation methods can be divided into air cooling and liquid cooling, and immersion cooling is an important form of liquid cooling. In the prior art, the immersion cooling device does not have specia...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/467H01L23/473H01L23/427H01L23/367
CPCH01L23/367H01L23/427H01L23/467H01L23/4735
Inventor 洪芳军袁璐凌崔付龙李健
Owner SHANGHAI JIAO TONG UNIV
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