Low-flow-resistance aviation liquid cooling case

Abstract

The invention discloses a low-flow-resistance aviation liquid cooling case, and belongs to the technical field of heat dissipation of airborne electronic devices. The low-flow-resistance aviation liquid cooling case comprises a case frame, a supporting plate, a front panel, a rear panel, a liquid inlet fluid connector, a liquid outlet fluid connector and an electric connector. The case frame comprises an upper cold plate, a lower cold plate, an upper cold plate cover plate, a lower cold plate cover plate, a right panel, a left panel and a back plate fixing plate; the upper cold plate, the lower cold plate and the right panel are internally provided with closed flow channels which are communicated with one another; the liquid inlet fluid connector, the liquid outlet fluid connector and the electric connector are installed on the right panel of the case frame, and the liquid inlet fluid connector and the liquid outlet fluid connector are both communicated with the flow channel in the right panel. The low-flow-resistance aviation liquid cooling case is reasonable in design, is easy to process, better in temperature consistency, low in flow resistance and is beneficial to reduction of power consumption of a liquid cooling pump, and the heat dissipation capacity of the liquid cooling case is further improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of airborne electronic equipment, in particular to an aviation liquid-cooled chassis with low flow resistance. Background technique [0002] With the improvement of information processing capabilities of airborne electronic equipment, the high-performance processing chips used in them also bring greater heat generation. In addition, the highly modular and integrated design concept of airborne equipment leads to higher heat flux density. Therefore, liquid-cooled heat dissipation has become the mainstream development direction of temperature control for airborne electronic equipment, and high-performance aviation liquid-cooled chassis has become a hot spot in the research of heat dissipation technology for airborne electronic equipment. Aviation liquid-cooled chassis require compact structure, light weight, good heat transfer performance, high strength, rigidity and low flow resistance. ...

AI Technical Summary

Problems solved by technology

However, due to the use of serpentine flow channels, the flow area is small, the path is long, the flow resistance of the chassis is large, the actual flow rate of the coolant is small, and there are disadvantages of poor heat transfer performance and temperature uniformity

When the multi-layer cold plate form is adopted, due to the asymmetric structure, the flow distribution of the internal cold plates is uneven, resulting in the same heat dissipation capacity obtained by each module, which further aggravates the problem of uneven temperature

In addition, the tailor welding of multiple cold plates also brings problems such as easy deformation and low yield

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