A kind of universal and portable splitting equipment and control method for LED substrate with double pressure head and two directions

Abstract

The invention discloses a double-pressing-head and two-way universal portable split-board device of a substrate for an LED, the device comprises a frame base, wherein a feeding mechanism, a one-fold material pushing and conveying mechanism, a one-fold plate pressing mechanism, a one-fold plate pulling mechanism, a one-fold emptying mechanism, a two-fold material pushing and conveying mechanism, atwo-fold plate pressing mechanism, a two-fold plate pulling mechanism, a two-fold emptying mechanism, a tray placing table are sequentially arranged on the frame base, wherein the one-fold material pushing and conveying mechanism comprises a one-fold material pushing platform, a one-fold initiating and pushing rod and a one-fold in-place material pushing module, the two-fold material pushing and conveying mechanism comprises a two-fold pushing platform and a two-fold material pushing plate, the structure is integrated, single one-fold processing can be achieved or one-fold and two-fold can besimultaneously used for a processing line of two-fold plates, the labor intensity is low, the degree of automation is high, a sensor and a PLC controller are combined, the system parameter setting andfeedback operation are achieved, the safety coefficient is high, the maintenance of the whole device is more convenient, the production efficiency is improved, the production cost is reduced, and theyield is high.

Description

technical field [0001] The invention relates to a processing and splitting equipment technology, in particular to a universal and convenient splitting equipment and a control method for LED substrates with double indenters and two directions. Background technique [0002] The substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided panel consists of a three-layer structure, which is a circuit layer (copper foil), an insulating layer, and a metal base layer. For high-end use, it is also designed as a double-sided board, and the structure is a circuit layer, an insulating layer, an aluminum base or a copper base, an insulating layer, and a circuit layer. Very few applications are multilayer boards, which can be laminated by ordinary multilayer boards with insulating layers, aluminum bases or copper bases. Because the substrates are mass-produced in large batches in the production process, they are subsequently cut into sma...

AI Technical Summary

Problems solved by technology

Because the substrates are mass-produced in large batches during the production process, they are subsequently cut into small substrates that meet the specifications in the corresponding sub-boards. The manual sub-board process is inefficient and easily damaged. The yield rate is low. In addition, Due to the limitation of its own design, the automatic splitting machine on the market can only perform one-time processing and splitting in a single direction when processing the whole substrate, and cannot perform omnidirectional bidirectional integrated splitting in the vertical and horizontal directions. The boarding direction is single, and the processing efficiency and yield rate of the boarding are low, which cannot meet the needs of batching and all-round boarding

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