A method for controlling the magnetic domain structure of antiferromagnetic layer and pinned layer to realize multi-state data storage in magnetic tunnel junction
A technology of magnetic tunnel junction and antiferromagnetic layer, which is applied in the field of data storage of information technology, can solve the problems of not considering the effective use of antiferromagnetic material performance, and achieve the effect of high thermal stability and high storage density
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[0035] A method for controlling the magnetic domain structure of an antiferromagnetic layer and a pinning layer to realize multi-state data storage in a magnetic tunnel junction, comprising the following steps:
[0036] (1) On a (001) Si substrate with a 300nm thick SiO2 oxide layer, a self-made magnetron sputtering apparatus is used to grow Ta with a thickness of 10nm, Cu with a thickness of 5nm, and Cu with a thickness of 10nm from bottom to top at room temperature. Ta, NiFe with a thickness of 5nm, IrMn with a thickness of 8nm, CoFeB with a thickness of 4nm, MgO with a thickness of 1.6nm, CoFeB with a thickness of 3nm, Ta with a thickness of 10nm, and Au with a thickness of 10nm, the background vacuum of the preparation instrument Better than 5×10- 5 Pascal. The background vacuum of the preparation instrument is better than 5×10- 5 Pascal. CoFeB with a thickness of 4nm is the pinning layer, which has a strong magnetic coupling with the IrMn layer and is difficult to chan...
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