A soft and hard bonding machine and a mounting method

A laminating machine, soft and hard technology, applied in the field of processing and manufacturing, can solve problems such as inability to place accurately, affect the quality of patch suction, and components without angle rotation adjustment, so as to improve the efficiency of patch suction and improve Fitting quality, reasonable structure effect

Inactive Publication Date: 2019-01-18
重庆隆成电子设备有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the structure of the patch suction device is complicated, and the components generally have no angle rotation adjustment, which canno

Method used

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  • A soft and hard bonding machine and a mounting method
  • A soft and hard bonding machine and a mounting method
  • A soft and hard bonding machine and a mounting method

Examples

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Embodiment Construction

[0039] Figure 1 to Figure 10 It is a relevant schematic diagram of a soft and hard laminating machine and laminating method described in this application. The present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.

[0040] The examples described here are specific specific implementations of the present invention, and are used to illustrate the concept of the present invention. They are all explanatory and exemplary, and should not be construed as limiting the implementation of the present invention and the scope of the present invention. In addition to the embodiments described here, those skilled in the art can also adopt other obvious technical solutions based on the claims of the application and the contents disclosed in the description, and these technical solutions include adopting any obvious changes made to the embodiments described here. Replacement and modified technical solutions.

[0041] The accompa...

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Abstract

The invention discloses a soft-hard bonding machine and a mounting method. The soft-hard bonding machine comprises a base, a mounting board, a film transmission system, an image acquisition system, asubstrate transmission system and a mounting suction system. The film transmission system and the substrate transmission system are arranged on the mounting board on the base, and the image acquisition system is arranged between the film transmission system and the substrate transmission system. The patch suction system is arranged on the patch servo system, the Z-direction motor on the patch suction system is arranged on the top of the support, the output shaft of the Z-direction motor is connected with the suction disk base through an adapter plate, and the adapter plate moves up and down along the first guide rail on the support; A plurality of suction disk assemblies are arranged on the suction disk base in parallel, the suction disk assemblies are connected with the lifting and pulling cylinders, and the suction disk assemblies move up and down along the second guide rail on the suction disk base; One side of the suction cup holder is provided with an image corrector, which is arranged in parallel with the suction cup assembly. The technical proposal provided by the invention has the advantages of reasonable structure and accurate positioning, and effectively ensures the bonding quality of the soft film and the substrate.

Description

technical field [0001] The invention belongs to the technical field of processing and manufacturing, and relates to a soft and hard laminating machine and a laminating method. Background technique [0002] The placement machine is also called "mounting machine". In the production line, it is configured after the dispensing machine or the screen printing machine. It is a device that accurately places surface mount components on the PCB pad by moving the placement head. [0003] As an important part of the whole machine, the patch suction device of the placement machine is very critical to the performance of the whole machine. After the placement machine picks up the original, it can automatically correct the position under the control of the calibration system, and accurately place the components on the designated position. In the prior art, the structure of the patch suction device is complicated, and the components generally have no angle rotation adjustment, which cannot ...

Claims

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Application Information

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IPC IPC(8): H05K13/04
CPCH05K13/0408
Inventor 胡峰
Owner 重庆隆成电子设备有限公司
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