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Chip hot melting and welding sealing machine

A packaging machine and chip technology, used in welding equipment, auxiliary welding equipment, welding/cutting auxiliary equipment, etc., can solve the problems of not very long quality life, high failure rate, low qualified rate, etc., to achieve novel design , Combination structure ingenious effect

Active Publication Date: 2019-01-22
深圳成为控股有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most of the current chips are processed by semi-automatic equipment in the process of inlaying, but in the process of processing, multiple stations are needed to complete the tasks of chip welding and packaging. It is very long; for example: in the process of chip welding, it is necessary to peel off the chip from the chip tape, transfer the carrier card to the conveyor belt, and solder the chip to the carrier card. These actions require manual or semi-automatic equipment operation, which is inefficient , High unqualified rate and other status quo, so there is a need for a chip hot-melt, welding packaging machine that can solve the above problems

Method used

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  • Chip hot melting and welding sealing machine
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Embodiment Construction

[0049] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0050] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "fixed", "integrated", "left", "right" and si...

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Abstract

The invention discloses a chip hot melting and welding sealing machine, which is provided with a work table, and the upper surface of the work table is provided with a bearing and conveying mechanism.One side of the load-carrying conveying mechanism is sequentially provided with a load-carrying dispatching mechanism and a load-carrying receiving mechanism from right to left; A material dispense auxiliary device, a glue injecting device, a detection mechanism, a hot weld mechanism, a prepressing mechanism, a hot melt mechanism, a pressing mechanism and a material receiving auxiliary device aresequentially arranged on that other side of the load-carrying conveying mechanism according to the working procedure; The above mechanisms are arranged on the workbench; Through the cooperation of the loading and dispatching mechanism and the dispatching auxiliary device, the automatic cutting function of the product is realized. The combination structure is ingenious and the design is novel. Thechip peeling, adsorption, transfer, thermal bonding, placement and other steps are fully automated through the cooperation of the chip transfer device and the thermal bonding device.

Description

technical field [0001] The invention belongs to the field of chip processing, and in particular relates to a chip heat-melting, welding and packaging machine. Background technique [0002] Most of the current chips are processed by semi-automatic equipment in the process of inlaying, but in the process of processing, multiple stations are needed to complete the tasks of chip welding and packaging. Very long; for example: in the process of chip welding, it is necessary to peel off the chip from the chip tape, transfer the carrier card to the conveyor belt, and solder the chip to the carrier card. These actions require manual or semi-automatic equipment operation, which is inefficient , high failure rate and other status quo, so a chip hot-melt, welding packaging machine that can solve the above problems is needed. Contents of the invention [0003] The invention provides a chip heat-melting and welding packaging machine, which solves the above-mentioned problems. [0004]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677B23K37/00
CPCB23K37/00H01L21/67742H01L21/67745
Inventor 不公告发明人
Owner 深圳成为控股有限公司
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