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A kind of halogen-free resin composition, cover film and copper clad laminate and printed circuit board prepared therefrom

A technology of resin composition and compound, applied in the direction of circuit substrate materials, printed circuit parts, synthetic resin layered products, etc., can solve the problem of poor storage stability, poor flexibility, aging resistance and chemical resistance in semi-cured state, etc. problems, to achieve the effect of improving storage stability, excellent acid resistance, and excellent flexibility

Active Publication Date: 2021-06-04
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Adhesives for traditional cover films use epoxy compounds / nitrile rubber as the main component, together with curing agents, flame retardants and other additives. Among them, nitrile rubber is a toughening component, too little dosage, poor flexibility; too much dosage , the initial adhesion of the adhesive layer is large, and it is not easy to operate; and the aging resistance and chemical resistance are poor, so it is difficult to use in high-end applications
[0003] JP2009-96940A, CN105482442A, CN102822304B, etc. use polyurethane as the main resin, with other resins such as epoxy compounds, phenolic resins, and flame retardants to prepare cover films. The flexibility and peel strength of the product are better, but its chemical resistance , aging resistance is still not good enough
[0004] Showa Denko's CN101687980B discloses a thermosetting resin composition, the thermosetting resin composition comprises polyurethane, a strong basic nitrogen-containing heterocyclic compound with a pKa value of 10.0-14.0, and products such as solder resists and protective films have non-stick properties. Excellent properties such as glue, low warpage and high insulation, but due to the high reactivity of the nitrogen-containing heterocyclic compound used, the storage stability of the semi-cured state of the resin composition is poor

Method used

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  • A kind of halogen-free resin composition, cover film and copper clad laminate and printed circuit board prepared therefrom
  • A kind of halogen-free resin composition, cover film and copper clad laminate and printed circuit board prepared therefrom
  • A kind of halogen-free resin composition, cover film and copper clad laminate and printed circuit board prepared therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-6

[0057] Prepare the resin composition according to the components shown in Table 1 (the amount of the components is in parts by weight), and dilute it with toluene and methyl ethyl ketone as solvents to obtain a glue solution, and make a cover film sample according to the following production method of the cover film.

[0058] Use a coating machine to coat the resin glue solution on a polyimide film with a thickness of 12.5 μm, control the thickness of the glue (dry glue) to be 15 μm, and then bake it in a high-temperature test box at 140 ° C for 2 minutes to obtain A partially cross-linked and cured adhesive layer is formed on the polyimide film, and then a release paper is laminated with the adhesive layer to obtain a cover film for a flexible printed circuit board.

Embodiment 7-12

[0060] Prepare the resin composition by the components shown in Table 1 (i.e. the composition of Example 7 is the same as Example 1, Example 8 is the same as Example 2, Example 9 is the same as Example 3, and Example 10 is the same as Example 1. 4 is the same, Example 11 is the same as Example 5, and Example 12 is the same as Example 6), and dilute with toluene and methyl ethyl ketone as solvents to obtain a glue solution, and make a copper-clad laminate sample according to the following method for making a single-sided copper-clad laminate.

[0061] The resin composition is coated on the polyimide film of 12.5 μm, and the thickness of the glue (dry glue) is controlled to be 15 μm, and the polyimide film coated with the resin composition is placed in a 140° C. high-temperature test box for drying. Bake for 2 minutes for semi-curing, then laminate the copper foil on the semi-cured adhesive layer, plasticize at 90-120°C, press at 180°C / 100kg for 60 seconds, and cure according to ...

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Abstract

The invention provides a halogen-free resin composition, a cover film, a copper-clad laminate and a printed circuit board prepared therefrom. The halogen-free resin composition comprises the following components in parts by weight: 60-90 parts of carboxyl-containing polyurethane, 5-35 parts of epoxy compound, 1-10 parts of blocked isocyanate and 0.5-5 parts of nitrogen-containing heterocyclic compound. The present invention uses carboxyl group-containing polyurethane resin as the main resin, and cooperates with epoxy compound, blocked isocyanate and nitrogen-containing heterocyclic compound to form a co-crosslinked network structure with high crosslinking density, which improves the storage stability of the semi-cured state of the composition At the same time, it has excellent flexibility, heat resistance, chemical resistance and flame retardancy. The cover film and copper clad laminate prepared from it have excellent acid resistance, heat resistance, flame retardancy and high peel strength.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and relates to a halogen-free resin composition, a cover film, a copper-clad laminate and a printed circuit board prepared therefrom. Background technique [0002] With the development of the flexible printed circuit board industry, the market has higher and higher requirements for the flexibility, chemical resistance and flame retardancy of cover films and copper clad laminates. Adhesives for traditional cover films use epoxy compounds / nitrile rubber as the main component, together with curing agents, flame retardants and other additives. Among them, nitrile rubber is a toughening component, too little dosage, poor flexibility; too much dosage , the initial adhesion of the adhesive layer is large, and it is not easy to operate; and the aging resistance and chemical resistance are poor, so it is difficult to use in high-end applications. [0003] JP2009-96940A, CN105482442A, CN102...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/04C09J11/06C09J7/30C09J7/25H05K1/03B32B7/12B32B15/08B32B27/28
CPCB32B7/12B32B15/08B32B27/281B32B2307/306B32B2307/3065B32B2379/08B32B2457/08C09J11/06C09J175/04C09J2475/00C09J2479/086C09J7/25C09J7/30C09J2301/122C09J2301/408H05K1/03C08K5/0025
Inventor 闫增阳茹敬宏伍宏奎
Owner GUANGDONG SHENGYI SCI TECH