Thin Film Heating Plate Components and Electronics
A technology of electronic equipment and heating plate, which is applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve problems such as uneven temperature distribution, excessive heating temperature rise, and poor heating effect, so as to avoid uneven heating and improve practicability , Guarantee the effect of quality and efficiency
Active Publication Date: 2020-09-22
CHENGDU TD TECH LTD
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Problems solved by technology
[0004] The invention provides a thin-film heating plate assembly and electronic equipment, which are used to solve the problems in the prior art that the heating temperature of chip components rises too fast, the temperature distribution is uneven, the heating effect is poor, and the reliability of long-term use is poor.
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[0030] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0031] In the present invention, terms such as "installation", "connection" and "fixation" should be broadly understood, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.
[0032] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " The orientation or positional relationship indicated by "rear", "left", "right", "vertical", "horizontal", "top", "bot...
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The invention provides a thin-film heating plate assembly and electronic equipment. The thin-film heating plate assembly comprises a metal base and a thin-film heating plate, wherein the metal base isarranged at one side of the electronic equipment, the electronic equipment comprises a chip component and a PCB where the chip component is located, the metal base and the electronic equipment form aclosed cavity used for accommodating the chip component, and the thin-film heating plate is located in the closed cavity and arranged on the inner surface of the metal base. According to the thin-film heating plate assembly and the electronic equipment provided by the invention, the metal base and the electronic equipment form the closed cavity capable of accommodating the chip component, the thin-film heating plate is arranged on the inner surface of the metal base, the heat generated by the thin-film heating plate forms a uniform local high-temperature area around the chip component throughthe conduction of the metal base after the thin-film heating plate is electrified, and the high-temperature area can carry out uniform heating on the chip component, thereby effectively avoiding thethermal stress caused by nonuniform heating or too fast temperature rise and the like of the chip component.
Description
technical field [0001] The invention relates to the technical field of heating plates, in particular to a thin film heating plate assembly and electronic equipment. Background technique [0002] With the continuous development of science and technology, electronic equipment is developing rapidly, and the working environment for electronic equipment is becoming more and more extensive. In order to ensure the reliability of electronic equipment in harsh low-temperature environments, it is necessary to heat the chip components in electronic equipment. The heating method generally uses a thin-film heating plate. The thin-film heating plate is composed of metal resistance wires and organic insulating films. The resistance wire is energized to generate heat, thereby achieving the effect of heating. At present, there are generally two ways to install the film heating plate: 1. The film heating plate is directly pasted on the surface of the chip components; 2. The film heating plat...
Claims
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IPC IPC(8): H01L23/34
CPCH01L23/345
Inventor 周维周瑞军熊兵袁乃华
Owner CHENGDU TD TECH LTD