AC-DC chip and high-voltage free-wheel diode integrated chip structure and power module group

Abstract

The invention provides an AC-DC chip and high-voltage free-wheel diode integrated chip structure, and belongs to the technical field of electronic device. The structure is characterized in that the interior of a plastic package body is provided with a first chip, a second chip, at least one lead frame, and a plurality of metal leads. The first chip is an AC-DC chip, and the second chip is a free-wheel diode chip. One bonding pad of the first chip is connected with a high-voltage power supply pin of the plastic package body through the metal leads, and a drain electrode of the first chip is connected with an anode of the second chip, wherein the surface of the cathode of the second chip is provided with a bonding pad, and is connected with the high-voltage power supply pin. The anode of thesecond chip is connected with a lead frame, and is lead out of the plastic package body to serve as a drain electrode pin. The invention also discloses the power module group employing the above integrated chip. Two core devices in a power drive board are integrated into one chip, and the number of pins of the new integrated chip and the pin positions still can be completely compatible with an original AC-DC chip, thereby avoiding the increase of the size of the chip while reducing the number of drive power devices, improving the production efficiency, and reducing the size and cost of the power supply.

Description

technical field

[0001] The invention relates to the technical field of electronic devices, in particular to an integrated chip structure of an AC-DC chip and a high-voltage freewheeling diode and a power supply module, which can integrate a high-voltage freewheeling diode into an AC-DC (AC to DC) chip, It is suitable for fields such as LED lighting drivers and mobile phone chargers that have high requirements for circuit board volume and cost. Background technique

[0002] Because of its high luminous efficiency, LED lighting has obvious energy saving and longer life than traditional lighting methods, and has become the mainstream lighting method in the world today. Especially light source products, such as bulbs, downlights and lamp tubes, are used in a huge amount. These products usually require a built-in power driver board, the space inside the lamp is very small, and the cost is extremely high due to the huge amount used.

[0003] The LED lamp beads used in lighting p...

Examples

Embodiment 1

[0024] Such as figure 1 As shown, in this embodiment, the first chip 1 is provided with an integrated structure, that is, the first chip 1 adopts an AC-DC chip including a control logic circuit and a power MOS device, wherein the first chip 1 and the second chip 2 They are respectively arranged on two independent lead frames. The first chip 1 is arranged on the lead frame where it is located through insulating glue, and the anode of the second chip 2 is connected to the lead frame where it is located through conductive glue or solder paste. On the first chip 1 The other pad 8 leads out the drain of the power MOS device in the first chip 1 through the metal lead 7, and is connected to the lead frame where the second chip 2 is located to form a connection with the anode of the second chip 2.

Embodiment 2

[0026] Such as figure 2As shown, in this embodiment, the first chip 1 is set as a split structure, that is, the first chip 1 includes a third chip 3 including a control logic circuit in AC-DC and a fourth chip 3 including a separate power MOS device. Chip 4. Wherein, the third chip 3 and the fourth chip 4 are respectively arranged on two independent lead frames, the third chip 3 is provided with at least two bonding pads 8, and one bonding pad 8 on the third chip 3 passes through the metal The lead 7 is connected to the high-voltage power supply pin 9 of the plastic package 5, another pad 8 on the third chip 3 is connected to the gate of the fourth chip 4 through the metal lead 7, and the drain of the fourth chip 4 is connected to the gate of the second chip 2. anode. In this embodiment, the fourth chip 4 and the second chip 2 are jointly arranged on the same lead frame, and the drain of the fourth chip 4 and the anode of the second chip 2 are connected to the lead frame th...

Embodiment 3

[0029] Such as image 3 As shown, in this embodiment, the first chip 1 is set as a split structure, that is, the first chip 1 includes a third chip 3 including a control logic circuit in AC-DC and a fourth chip 3 including a separate power MOS device. Chip 4. Wherein, the fourth chip 4 and the second chip 2 are jointly arranged on the same lead frame through conductive glue or solder paste, and the drain electrode of the fourth chip 4 and the anode of the second chip 2 are connected to the lead wire through conductive glue or solder paste. frame, the third chip 3 is arranged on the gate surface of the fourth chip 4 through insulating glue, at least two pads 8 are arranged on the third chip 3, and one pad 8 on the third chip 3 passes through a metal lead 7 Connect the high-voltage power supply pin 9 of the plastic package 5, another pad 8 of the third chip 3 is connected to the gate of the fourth chip 4 through the metal lead 7, and the lead frame protrudes from the plastic pa...

technical field

[0001] The invention relates to the technical field of electronic devices, in particular to an integrated chip structure of an AC-DC chip and a high-voltage freewheeling diode and a power supply module, which can integrate a high-voltage freewheeling diode into an AC-DC (AC to DC) chip, It is suitable for fields such as LED lighting drivers and mobile phone chargers that have high requirements for circuit board volume and cost. Background technique

[0002] Because of its high luminous efficiency, LED lighting has obvious energy saving and longer life than traditional lighting methods, and has become the mainstream lighting method in the world today. Especially light source products, such as bulbs, downlights and lamp tubes, are used in a huge amount. These products usually require a built-in power driver board, the space inside the lamp is very small, and the cost is extremely high due to the huge amount used.

[0003] The LED lamp beads used in lighting p...

Examples

Embodiment 1

[0024] Such as figure 1 As shown, in this embodiment, the first chip 1 is provided with an integrated structure, that is, the first chip 1 adopts an AC-DC chip including a control logic circuit and a power MOS device, wherein the first chip 1 and the second chip 2 They are respectively arranged on two independent lead frames. The first chip 1 is arranged on the lead frame where it is located through insulating glue, and the anode of the second chip 2 is connected to the lead frame where it is located through conductive glue or solder paste. On the first chip 1 The other pad 8 leads out the drain of the power MOS device in the first chip 1 through the metal lead 7, and is connected to the lead frame where the second chip 2 is located to form a connection with the anode of the second chip 2.

Embodiment 2

[0026] Such as figure 2As shown, in this embodiment, the first chip 1 is set as a split structure, that is, the first chip 1 includes a third chip 3 including a control logic circuit in AC-DC and a fourth chip 3 including a separate power MOS device. Chip 4. Wherein, the third chip 3 and the fourth chip 4 are respectively arranged on two independent lead frames, the third chip 3 is provided with at least two bonding pads 8, and one bonding pad 8 on the third chip 3 passes through the metal The lead 7 is connected to the high-voltage power supply pin 9 of the plastic package 5, another pad 8 on the third chip 3 is connected to the gate of the fourth chip 4 through the metal lead 7, and the drain of the fourth chip 4 is connected to the gate of the second chip 2. anode. In this embodiment, the fourth chip 4 and the second chip 2 are jointly arranged on the same lead frame, and the drain of the fourth chip 4 and the anode of the second chip 2 are connected to the lead frame th...

Embodiment 3

[0029] Such as image 3 As shown, in this embodiment, the first chip 1 is set as a split structure, that is, the first chip 1 includes a third chip 3 including a control logic circuit in AC-DC and a fourth chip 3 including a separate power MOS device. Chip 4. Wherein, the fourth chip 4 and the second chip 2 are jointly arranged on the same lead frame through conductive glue or solder paste, and the drain electrode of the fourth chip 4 and the anode of the second chip 2 are connected to the lead wire through conductive glue or solder paste. frame, the third chip 3 is arranged on the gate surface of the fourth chip 4 through insulating glue, at least two pads 8 are arranged on the third chip 3, and one pad 8 on the third chip 3 passes through a metal lead 7 Connect the high-voltage power supply pin 9 of the plastic package 5, another pad 8 of the third chip 3 is connected to the gate of the fourth chip 4 through the metal lead 7, and the lead frame protrudes from the plastic pa...

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