40results about How to "Reduce volume cost" patented technology

A drill cuttings slurry process system is disclosed for defluidizing earth drill cuttings, thereby extracting valuable drilling additives and returning them to the drilling system while producing a dense, drier material which may be discharged directly in the environment at or near the well being drilled or chemically treated for distillation and/or better dissolution into the environment, thereby reducing, cost in transportation and environmental treatment chemicals thus reducing environmental contamination. The system comprising a cuttings press having solids/fluids separation a dryer and/or a retort for flashing off any residual petroleum residue and moisture, a fines grinder and a chemical injection system. The retort including an analyzer system for weighing and determining rate of throughput and analyzing the cuttings for residual petroleum residue content prior to discharge to environment or further refinement prior to reinjection into the well or transport to environmental depository sites.

The invention relates to the technical field of silicon optical chip coupling, and provides a coupling method and a coupling structure of a silicon optical chip. The coupling structure comprises an optical assembly, a silicon optical chip 1 and a PCB 8, wherein the optical assembly comprises a laser chip 2, a coupling lens 3, an optical fiber 4, a glass cover plate 5, a V-shaped groove base plate6 and an external connection port 7. The coupling method comprises the steps of binding and fixing the silicon optical chip 1 and the V-shaped groove base plate 6 on the PCB 8, arranging the optical fiber 4 in the chip V-shaped groove 1-1 in the coupling end face of the silicon optical chip 1, and placing the other end in the V-shaped groove 6-1 in the V-shaped groove base plate 6. The silicon optical chip adopted by the invention is an end surface coupling structure, the coupling and packaging difficulty of the silicon waveguide is simplified through a V-shaped groove structure, and passive coupling packaging is realized.

A processing apparatus includes a loading chamber; a buffer chamber connected to the loading chamber; a first process chamber connected to the buffer chamber; and an unloading chamber connected to the first process chamber, wherein a processing path through the processing apparatus is a forward in-line path in a direction through the loading chamber, the buffer chamber, the first process chamber, and the unloading chamber.

The invention relates to a millimeter wave sensor and an intelligent detector. The millimeter wave sensor includes a signal generator, a transceiver integrated chip, a bandpass filter, an amplifier, an A/D converter and a digital signal processor connected in sequence. Compared with the existing 24/77GHz millimeter wave sensor, the millimeter wave sensor has higher signal frequency, strong beam directivity, strong anti-interference ability, small size and light weight; in addition, it adopts the transceiver integrated chip based on SiGe process Compared with the sensor composed of discrete devices, it has the advantages of simple structure, small size and portability, convenient mass production, and low cost, which greatly improves the adaptability of the sensor and provides strong technical support for the increasingly complex information detection environment in the future.

A coil structure for wireless power transmission is provided. The coil structure comprises: a primary resonance coil wound in a spiral shape around a centripetal point; a primary induction coil, which supplies power to the primary resonance coil in a nonconnected state with an input or output terminal of the primary resonance coil and is wound in a spiral shape on a substantially same plane around a substantially same centripetal point as the centripetal point; a switch configured to be parallel with the primary resonance coil so as to control the ON and OFF of an operation of the primary resonance coil; and a capacitor coupled to the primary resonance coil so as to form a magnetic resonance with the primary resonance coil.

A rake assembly with pickup function comprises a handle rod having an end connected to a rake plate; a two-piece pivotal link rod with one end connected to a clamping plate, and the handle rod passes through the space between the two pivotal link rods at a position proximate to the body of the rake plate, a pair of link plates with both ends pivotally coupled to the handle rod and the body of the pivotal rods; a pushing rod being parallel to the handle rod and shifted along the body of the handle rod, and the bottom of the pushing rod is connected to the link rods. By the foregoing structure, users can push or pull the pushing rod along the handle rod to drive the pivotal link rod and the handle rod for alternate pivotal movements and thus producing a clamping movement or a releasing movement between the rake plate and the clamping plate.

A secondary air injection system may include an engine that includes a plurality of cylinders that generate a driving torque of a vehicle by combustion of a fuel; a main line connected to an exhaust manifold or an exhaust line which is connected to the plurality of cylinders; a recirculation line which is branched from the main line and then connected to an intake manifold; an air injection line which is branched from the main line and then connected to an intake line; and an electric supercharger which is provided in the intake line.

A capacitive touch panel with single sensing layer has a substrate. The substrate has the single sensing layer formed thereon. The sensing layer has multiple electrode sets. Each electrode set has multiple driving electrode rows and multiple receiving electrode rows arranged alternately. The multiple driving electrode rows of one electrode set have different driving electrodes, but different electrode sets have the same multiple driving electrode rows. The multiple receiving electrode rows of one electrode set are consisted of multiple same receiving electrodes, but different electrode sets have different receiving electrode rows. Therefore, using less contacts can also maintained the area and the solution so that the pins on the IC are also decreased. Thus, the volume of the IC is reduced and the packaging cost is also reduced.

The invention discloses a brushless direct current motor driving system for a capacitor-less direct-current converter. The converter is evolved from a conventional Buck converter; and in an evolution process, Buck bus capacitors are removed, and a switch tube is in parallel connection with an inductor so as to provide a continuous current circuit for the inductor at the commutation moment of a motor. The driving system employs a speed and current double closed-loop control manner, and inner and outer loops are controlled by PI regulators. According to the invention, the switch tube is subjected to PWM chopping, and charging and discharging of the inductor are controlled, so that phase currents of the brushless direct current motor are controlled. The driving topology simplifies the pre-stage topology structure of a conventional Buck circuit brushless direct current motor driving system, conventional voltage control is replaced by current control, and the driving topology is suitable for driving the brushless direct current motor whose ideal current waveforms are square waves. Compared with the Buck converter, the converter topology does not need the bus capacitors, so that the cost and size of the driving system are greatly reduced.

A fuel-cell system is disclosed. The fuel cell system includes: a system module having one or more fuel-cell stacks, a first reformer for converting at least some of hydrocarbon fuel into hydrogen, and supplying the hydrogen to the fuel-cell stacks, and a housing for receiving the fuel-cell stacks, and the first reformer therein; and a start-up module disposed outside the housing, and removably coupled to the system module, wherein the start-up module supplies hydrogen-containing fuel to the fuel-cell stacks until a temperature of the fuel-cell stack reaches a predetermined temperature.

The invention provides a tile type active phased array sub-array based on a plastic package silicon-based TR chip. The active phased array sub-array comprises an antenna sub-array, a transceiving circuit board and a metal heat dissipation shell; the antenna sub-array is composed of M*N double-layer broadband micro-strip patch radiation units; the transceiving circuit board and all the double-layer broadband micro-strip patch radiating units are stacked, corresponding M*N transceiving channels, control power supply distribution and a power division and synthesis network are integrated into a whole by adopting a multi-layer mixed pressing plate structure, the multiple transceiving channels located at the same partition position are integrated in a plastic package silicon-based TR chip on the transceiving circuit board, and a tile type structure is formed; and a heat conduction metal path is arranged between the plastic package silicon-based TR chip and the metal heat dissipation shell. The system is high in reliability, standardized active phased array sub-arrays which can be freely spliced are formed, and convenience is provided for constructing phased arrays of any scale.

The invention belongs to the technical field of phased array radars, and relates to an X-band high-integration-level two-dimensional phased array radar radio frequency front end. The X-band high-integration-level two-dimensional phased array radar radio frequency front end comprises an antenna housing, active phased array subarrays adopting a silicon-based TR chip, a heat dissipation shell, a power division and synthesis network, a wave control power supply board, a sum-difference network, a frequency synthesizer receiver and a data acquisition board, the heat dissipation shell serves as a main body support, the multiple active phased array subarrays are installed on the heat dissipation shell, heat generated by the active phased array subarrays is conducted to the heat dissipation shell, and the heat is conducted to the two sides of the heat dissipation shell through heat pipes on the back of the heat dissipation shell. The sum-difference network and the wave control power panel are correspondingly arranged on the same plane, and the wave control power panel and the sum-difference network are installed on the back face of the heat dissipation shell and share the back area. The X-band high-integration-level two-dimensional phased array radar radio frequency front end has the characteristics of low cost, high integration level, modularization, strong heat dissipation capability and high reliability, and has rapid maintenance capability.

The invention provides an AC-DC chip and high-voltage free-wheel diode integrated chip structure, and belongs to the technical field of electronic device. The structure is characterized in that the interior of a plastic package body is provided with a first chip, a second chip, at least one lead frame, and a plurality of metal leads. The first chip is an AC-DC chip, and the second chip is a free-wheel diode chip. One bonding pad of the first chip is connected with a high-voltage power supply pin of the plastic package body through the metal leads, and a drain electrode of the first chip is connected with an anode of the second chip, wherein the surface of the cathode of the second chip is provided with a bonding pad, and is connected with the high-voltage power supply pin. The anode of thesecond chip is connected with a lead frame, and is lead out of the plastic package body to serve as a drain electrode pin. The invention also discloses the power module group employing the above integrated chip. Two core devices in a power drive board are integrated into one chip, and the number of pins of the new integrated chip and the pin positions still can be completely compatible with an original AC-DC chip, thereby avoiding the increase of the size of the chip while reducing the number of drive power devices, improving the production efficiency, and reducing the size and cost of the power supply.

The invention discloses a compact adsorption refrigeration system, which comprises a container shell, a partition plate, a steam four-way valve, a cold and heat source fluid inlet four-way valve, anda cold and heat source fluid outlet four-way valve. The partition plate divides the container shell into four cavities; a first adsorption bed, a second adsorption bed, a condenser and an evaporator are arranged in the four cavities; the steam four-way valve can control the communication of the four cavities; and the cold and heat source fluid inlet four-way valve and the cold and heat source fluid outlet four-way valve can control cold running water and hot running water of the first adsorption bed and the second adsorption bed to flow in and out. The compact adsorption refrigeration system provided by the invention is not only more convenient to control and beneficial for reducing the energy consumption and reducing system parts, but also compact and high-efficient in structure, beneficial for reducing the system volume and the cost, and low in manufacturing cost.

The invention discloses a small integrated YTF non-linear characteristic testing system and method. The mall integrated YTF non-linear characteristic testing system includes a PC machine connected to a processor, the processor is connected to a YIG tuned filter through a digital-to-analogue conversion module and a current-to-voltage conversion module in sequence, the processor is further connected to a first radio-frequency switch through a broadband signal generator, the first radio-frequency switch is connected to a second radio-frequency switch which is connected to the YIG tuned filter, and the second radio-frequency switch is further connected to a third radio-frequency switch; the output end of the YIG tuned filter is connected with the third radio-frequency switch which is connected to a broadband signal electrical-level detection module, and the broadband signal electrical-level detection module is connected to the processor through the digital-to-analogue conversion module. Compared with a traditional testing method, the system greatly reduces the complexity and does not rely on other external instruments or equipment any more, the volume cost is greatly reduced, and actual tests show that the system can accurately extract non-linear characteristics of a YTF.

A magnetic loop of a high-speed motor of an electric vehicle is formed in an injection molding and mold pressing mode by sleeving a mold with a magnetic ring. The magnetic loop is characterized in that an inner hole is formed in the magnetic loop, a salient pole pin is manufactured in the inner hole, the inner hole is matched with a motor shaft, the salient pole pin is limited by a motor shaft pin groove, the magnetic ring is located on the radial peripheral wall of the magnetic loop, two end faces of the radial outside of the magnetic ring are provided with steps, the edges of the steps are covered with plastic, and the steps are used for straight limiting; at least one salient pole pin body is arranged on the inner diameter portion of the magnetic ring and used for circumferential limiting of the magnetic ring, and 180-degree line-connection alignment is carried out on the salient pole pin bodies and the salient pole pin of the inner hole with the circle center of the inner hole as the center; a fan is arranged at the joint of the inner hole and an outer ring and used for heat dissipation of the motor, the magnetic loop is straightly aligned with a Hall ring in a balanced mode when assembled and installed, and the magnetic loop shows the angle and position of a Hall element through rotation of the motor shaft.