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Coupling method and coupling structure of silicon optical chip

A technology of silicon optical chip and coupling structure, which is applied in the coupling of optical waveguide, light guide, optics, etc., can solve the problems of inapplicability, and achieve the effect of simple and compact structure, simplified coupling and packaging difficulty, and small size

Inactive Publication Date: 2018-04-20
WUHAN TELECOMM DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The technical problem to be solved by the present invention is that the traditional laser chip-lens-waveguide coupling method cannot be applied when coupling and packaging a silicon optical chip with a V-groove design structure.

Method used

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  • Coupling method and coupling structure of silicon optical chip
  • Coupling method and coupling structure of silicon optical chip
  • Coupling method and coupling structure of silicon optical chip

Examples

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Embodiment 1

[0046] Embodiment 1 of the present invention provides a silicon optical chip coupling method, such as figure 1 As shown, the coupling structure includes an optical component, a silicon photonics chip 1 and a PCB board 8, wherein the optical component includes a laser chip 2, a coupling lens 3, an optical fiber 4, a glass cover 5, a V-groove substrate 6 and an external port 7, and the coupling method includes :

[0047] Bond and fix the silicon photonics chip 1 and the V-groove substrate 6 on the PCB board 8; place one end of the optical fiber 4 in the chip V-groove 1-1 on the coupling end surface of the silicon photonics chip 1, and place the other end of the optical fiber 4 In the V-groove 6-1 of the V-groove substrate 6;

[0048] Wherein, the laser chip 2 , the coupling lens 3 , the optical fiber 4 and the glass cover 5 are arranged on the V-groove substrate 6 .

[0049] Usually, the silicon photonic chip 1 also includes silicon waveguide coupling structures, couplers, mod...

Embodiment 2

[0061] The embodiment of the present invention also provides a coupling structure of a silicon photonics chip, the coupling structure includes an optical component, a silicon photonics chip 1 and a PCB board 8, wherein the optical component includes a laser chip 2, a coupling lens 3, an optical fiber 4, and a glass cover 5 , V-groove substrate 6 and external port 7, the coupling structure includes:

[0062] The silicon photonics chip 1 and the V-groove substrate 6 are bonded and fixed on the PCB board 8;

[0063] The optical fiber 4 is set in the chip V-groove 1-1 on the coupling end surface of the silicon photonics chip 1, and the other end is placed in the V-shaped groove 6-1 of the V-groove substrate 6;

[0064] Wherein, the laser chip 2 , the coupling lens 3 , the optical fiber 4 and the glass cover 5 are arranged on the V-groove substrate 6 .

[0065] The silicon photonics chip adopted in the embodiment of the present invention has an end-face coupling structure, and the...

Embodiment 3

[0069] The present invention also sets forth a coupling structure of a silicon photonics chip in a relatively complete manner starting from an industrial realization mode. The entire coupling element such as Figure 5 As shown, it consists of optical components, silicon photonics chip 1, PCB board 8, glass spacer 9, ultraviolet glue 10 and matching liquid 11, wherein the optical component consists of laser chip 2, coupling lens 3, optical fiber 4, glass cover plate 5, V The slot substrate 6 and the LC Receptacle 7 are coupled and packaged.

[0070] The silicon photonics chip 1 includes a silicon waveguide coupling structure, couplers, modulators, MPD, PD, TIA, laser drivers and other optoelectronic components. The chip coupling end surface is composed of a chip V groove 1-1 and a cantilever silicon waveguide 1-2. The silicon waveguide of the conventional silicon optical chip also adopts a cantilever design structure. The end face of the silicon waveguide is directly coupled w...

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Abstract

The invention relates to the technical field of silicon optical chip coupling, and provides a coupling method and a coupling structure of a silicon optical chip. The coupling structure comprises an optical assembly, a silicon optical chip 1 and a PCB 8, wherein the optical assembly comprises a laser chip 2, a coupling lens 3, an optical fiber 4, a glass cover plate 5, a V-shaped groove base plate6 and an external connection port 7. The coupling method comprises the steps of binding and fixing the silicon optical chip 1 and the V-shaped groove base plate 6 on the PCB 8, arranging the optical fiber 4 in the chip V-shaped groove 1-1 in the coupling end face of the silicon optical chip 1, and placing the other end in the V-shaped groove 6-1 in the V-shaped groove base plate 6. The silicon optical chip adopted by the invention is an end surface coupling structure, the coupling and packaging difficulty of the silicon waveguide is simplified through a V-shaped groove structure, and passive coupling packaging is realized.

Description

【Technical field】 [0001] The invention relates to the technical field of silicon photonic chip coupling, in particular to a coupling method and a coupling structure of a silicon photonic chip. 【Background technique】 [0002] With the explosive development of mobile Internet, big data, high-definition video and other services, the demand for communication system capacity and transmission rate continues to increase. Silicon-based photonic integration technology based on SOI materials has become the future development trend of optical devices. Silicon waveguides have high refractive index differences, enabling compact photonic devices in CMOS-compatible processes. At the same time, it can also be integrated with microelectronic devices to realize the integration of multiple photoelectric components, realize standardization and mass production, and effectively reduce the cost of devices. [0003] The size of the silicon waveguide is sub-micron, and the mode spot in the optical...

Claims

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Application Information

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IPC IPC(8): G02B6/42
CPCG02B6/4204G02B6/421G02B6/4296
Inventor 杜巍宋琼辉
Owner WUHAN TELECOMM DEVICES
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