LED (light-emitting diode) display screen packaging process based on COB (chip on board) technique and LED display screen
A technology of LED display and packaging technology, applied in the direction of identification devices, instruments, electrical components, etc., can solve the problems affecting the service life of LED display, poor sealing of LED display packaging structure, etc., to ensure the use effect and use efficiency, The effect of good packaging and high practicability
Inactive Publication Date: 2019-02-12
天长市辉盛电子有限公司
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Problems solved by technology
With the continuous progress of social economy and the continuous improvement of LED display technology, people's understanding of LED display will become more and more in-depth, and its application fields will become wider and wider. The traditional LED display packaging process is relatively fixed. Especially for outdoor LED display screens, waterproof and sealing performance are particularly important, which will directly affect the service life of LED display screens. After research, the inventor found that the packaging structure of LED display screens has poor sealing performance. How to invent a COB technology Solving these problems with advanced LED display packaging technology and LED display has become a problem to be solved urgently by those skilled in the art
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[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0026] see Figure 1-2 , the present invention provides a technical solution: a LED display packaging process based on COB technology, which specifically includes the following steps:
[0027] S1: First detect whether there is mechanical damage on the surface of the LED light-emitting chip 4, and then use testing equipment to detect whether the LED light-emitting chip 4 can emit light one by one, test the photoelectric parameters of the LED light-emitting chip...
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The invention discloses an LED (light-emitting diode) display screen packaging process based on a COB (chip on board) technique and an LED display screen. The process includes the steps: firstly, detecting whether the surfaces of LED chips are mechanically damaged or not, collecting zero-damage LED chips capable of normally emitting light for standby application, expanding membranes of bonding chips by a chip expander to facilitate subsequent group welding, placing a circuit board into ultrasonic cleaning device, and cleaning impurities and dust on the surface of the circuit board; secondly, drying the circuit board by a drying device, placing the circuit board on a fixture, fixing the circuit board, sucking up and moving the LED light emitting chips by a vacuum nozzle, mounting the LED light emitting chips at the corresponding positions, welding the LED light emitting chips by a manipulator, filling space between a light emitting mask and a second sealing filler with glue, filling space between an LED support and the second sealing filler with glue, filling gaps among light emitting holes and the LED light emitting chips with epoxy, and strictly controlling temperature and humidity of a work environment. The process is high in welding efficiency and good in packaging effect.
Description
technical field [0001] The invention relates to the technical field of LED display screens, in particular to an LED display screen packaging process and LED display screen based on COB technology. Background technique [0002] As an important means of information dissemination, LED screens have become a symbol of urban information modernization. With the continuous progress of social economy and the continuous improvement of LED display technology, people's understanding of LED display will become more and more in-depth, and its application fields will become wider and wider. The traditional LED display packaging process is relatively fixed. Especially for outdoor LED display screens, waterproof and sealing performance are particularly important, which will directly affect the service life of LED display screens. After research, the inventor found that the packaging structure of LED display screens has poor sealing performance. How to invent a COB technology Solving these p...
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IPC IPC(8): H01L33/48H01L33/52H01L25/075G09F9/33
CPCH01L33/48G09F9/33H01L25/0753H01L33/52H01L2933/0033H01L2933/005
Inventor 钱砚秋
Owner 天长市辉盛电子有限公司