Method for defect-free copper filling of hole in part carrying member and plating device

Abstract

The invention discloses a method of using copper (110) to fill a hole (120) formed in a part carrying member (100). The method includes: i), forming a conductive material layer (111) covering at leasta part of a surface (131) of a wall (130) which defines the hole (120); ii), using the cooper (110) for a plating process including bath to partly cover the layer (111) at least and to partly fill unfilled volume (121) of the hole (120) at least, wherein the bath includes copper ions, especially Cu2+, with concentration within a range of 50-75g / L, especially 60-70g / L.

Description

technical field [0001] The invention generally relates to the filling of holes in component carriers. In particular, the invention relates to filling holes in component carriers with copper by plating, while avoiding defects in the copper-filled holes. Furthermore, the invention relates to a device for carrying out the method. Furthermore, the invention relates to a component carrier produced by this method. Background technique [0002] Electronic assemblies and circuits including electronic components are typically built on a component carrier such as a printed circuit board (PCB). The manufacturing process of so-called multilayer component carriers usually involves filling the holes in the component carrier with an electrically conductive material, such as copper. [0003] The density and complexity of electronic components continues to increase, while the holes in the component carriers (such as laser drilled holes) are getting smaller and the aspect ratios (aspect ra...

AI Technical Summary

Problems solved by technology

These defects 350 directly lead to an irregular growth process of the copper material 310 as gaps 345 remain during the growth process, and eventually lead to irreparable cracks and / or voids

However, the flow of chemical additives cannot effectively reach the gap 345 between the plurality of copper material portions 310

Therefore, as in Figure 4b As seen in , in the final component carrier 400 there are still defects such as cracks and / or voids in the filled copper material 310

As a result, filling hole 520 with conductive material is hampered and cannot be done in an efficient manner.

[0011] Because processes using chemical additives often do not work efficiently, performance is often poor and defects remain

Furthermore, chemical additives lead to additional costs and are generally harmful to the environment, and so far no effective process for defect-free filling of holes in component carriers has been provided

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