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Pressure sensor

A pressure sensor and pressure technology, which is applied in the direction of instruments, measurement force, and measurement of the property force of piezoelectric resistance materials, etc., can solve the problems of insufficient corrosion resistance of silicon pressure sensors, and achieve easy miniaturization and high measurement accuracy , fast dynamic response effect

Pending Publication Date: 2019-02-15
华景传感科技(无锡)有限公司
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  • Abstract
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Problems solved by technology

[0003] However, the existing silicon pressure sensors have insufficient corrosion resistance and are not suitable for use in harsh environments such as corrosive gases.

Method used

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Embodiment Construction

[0025] The present invention will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for ease of description, the drawings only show part of the structure related to the present invention, but not all of the structure.

[0026] figure 1 Is a schematic diagram of a pressure sensor provided by an embodiment of the present invention, refer to figure 1 , The pressure sensor includes:

[0027] Ceramic substrate 10 and silicon pressure sensor chip 20;

[0028] The ceramic substrate 10 includes a first surface 11 and a second surface 12 opposed to each other. The first surface 11 is provided with a groove 13 as a pressure back cavity. The pressure sensor chip 20 is attached to the second surface 12 and the recess through an adhesive layer 30. The area corresponding t...

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Abstract

The embodiment of the invention discloses a pressure sensor. The pressure sensor comprises a ceramic substrate and a silicon pressure sensing chip. The ceramic substrate comprises a first surface anda second surface arranged opposite to each other. The first surface is provided with a groove used as a pressure back cavity. The pressure sensing chip is attached to an area of the second surface corresponding to the groove through a bonding layer. The embodiment of the invention provides a pressure sensor with corrosion resistance, high temperature resistance, high stability, high precision andlow cost.

Description

Technical field [0001] The embodiment of the present invention relates to pressure sensing technology, in particular to a pressure sensor. Background technique [0002] The principle of silicon piezoresistive pressure sensor is to use the piezoresistive effect of semiconductor materials. It is the most widely used pressure sensor. It has high sensitivity, fast dynamic response, high measurement accuracy, good stability, wide operating temperature range, and easy The advantages of miniaturization, easy mass production and convenient use. [0003] However, the existing silicon pressure sensor has insufficient corrosion resistance and is not suitable for application in harsh environments such as corrosive gas. Summary of the invention [0004] The invention provides a pressure sensor to provide a pressure sensor with corrosion resistance, high temperature resistance, high stability, high precision and low cost. [0005] An embodiment of the present invention provides a pressure sensor,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/18
CPCG01L1/2293
Inventor 缪建民曹峰
Owner 华景传感科技(无锡)有限公司
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