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Method and semiconductor device for processing wafer edge by selective wet process

A wet processing and selective technology, which is applied to devices that selectively process different parts of the wafer surface. The wet process only processes the edge of the wafer. Residues, etc.

Active Publication Date: 2019-02-22
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Generally speaking, various processes do not perform special treatment on the edge area, which leads to easy residues or defects on the edge of the wafer, such as various films that have not been cleaned, etching residues, etc.

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  • Method and semiconductor device for processing wafer edge by selective wet process
  • Method and semiconductor device for processing wafer edge by selective wet process
  • Method and semiconductor device for processing wafer edge by selective wet process

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Embodiment Construction

[0029] In the following description, the present invention is described with reference to various examples. One skilled in the art will recognize, however, that the various embodiments may be practiced without one or more of the specific details, or with other alternative and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure aspects of the various embodiments of the invention. Similarly, for purposes of explanation, specific quantities, materials and configurations are set forth in order to provide a thorough understanding of embodiments of the invention. However, the invention may be practiced without these specific details. Furthermore, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0030] In this specification, reference to "one embodiment" or "the...

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Abstract

The invention discloses a selective wet process method and equipment device. The selective wet process method is applied to wafer-level fan-out packaging process integration in order to remove residual glue on the edges of silicon wafers, glass, or other substrate wafers after a conventional glue removal treatment. The selective wet process method includes: placing the back surface of a wafer to be processed on the lower sealing ring of a semiconductor device for processing the wafer edge by a selective wet process, and moving a processing chamber in the Z-axis to make a upper sealing ring contact the wafer such that the edge of the wafer is sealed in a glue-removing processing chamber of the semiconductor device; adding a residual glue-removing solution to the processing chamber, and performing a wet process just on the edge portion of the wafer to be processed; after a predetermined glue removal time, discharging the used glue-removing solution in the processing chamber; processing and washing the edge of the wafer with pure water; and closing a pure water supply valve is closed, and drying the wafer with an inert gas.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit manufacturing, in particular, the invention relates to a device for selectively processing different parts of the wafer surface, specifically a device for processing only the edge of the wafer in a wet process. Background technique [0002] With the development of miniaturization, integration and intelligence of microelectronic products, the complexity of integrated circuit chips has increased significantly. In integrated circuit manufacturing, edge processing requirements vary among hundreds of different process equipment. Even if the products of the same type or even the same manufacturer have the same margin size specified in the program, there will inevitably be non-repeatability of the placement of the wafer in the process chamber during the transfer and transportation of the wafer, and the result is Uncertainty in process and product yield in the fringe area. [0003] The ed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/67
CPCH01L21/02087H01L21/67051
Inventor 姚大平
Owner NAT CENT FOR ADVANCED PACKAGING