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Laser transmitter, laser receiver, wafer leveling device and wafer leveling method

A laser transmitter and laser receiver technology, applied in semiconductor/solid-state device testing/measurement, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as lack of degrees of freedom, improve installation efficiency, high accuracy, high degree of freedom

Active Publication Date: 2020-10-02
BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a laser transmitter to solve the technical problem of lack of freedom in the prior art

Method used

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  • Laser transmitter, laser receiver, wafer leveling device and wafer leveling method
  • Laser transmitter, laser receiver, wafer leveling device and wafer leveling method
  • Laser transmitter, laser receiver, wafer leveling device and wafer leveling method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] See figure 1 , figure 2 , image 3 , a laser transmitter 1, including a laser emitting end assembly 11 and a first installation base 12 for fixing the laser emitting end assembly 11, the first installation base 12 includes a fixing base 121, a connecting piece 122, a connecting base 123 and Install the bracket 124, the laser emitting end assembly 11 is connected on the fixed seat 121, and can emit the laser beam toward the first direction; the fixed seat 121 is connected on the connecting seat 123 through the connecting piece 122, and the fixed seat 121 can be around the second direction Rotation; the connecting base 123 is connected to the mounting bracket 124, and the connecting base 123 can move up and down along the third direction and can rotate around the third direction, wherein, the first direction, the second direction and the third direction are arranged perpendicular to each other, and the third direction The direction is the length direction of the mounti...

Embodiment 2

[0081] A limiting protrusion is provided on the outer wall of the connecting piece, and a corresponding limiting groove is provided on the inner wall of the third mounting hole. Other parts are the same as the first embodiment of the laser emitter.

[0082] In this embodiment, the movement of the fixing seat along the second direction is limited by setting the limiting groove and the limiting protrusion.

[0083] Embodiment one of the laser receiver:

[0084] See Figure 4 , a laser receiver 2, including a laser receiving end assembly 21 and a second mounting base 22 for fixing the laser receiving end assembly 21, the structure of the second mounting base 22 is the same as that of the laser transmitter 1 of any of the above-mentioned embodiments Corresponds to the first installation base 12 in.

[0085] The laser receiver can be used in conjunction with the laser transmitter, wherein the structure of the second mounting base corresponds to the first mounting base of the abo...

Embodiment 3

[0097] A level for measuring the level is provided on the base or the mounting bracket. The rest is the same as the second implementation of the wafer leveler.

[0098] The setting of the level is convenient for leveling the laser emitting end assembly and the laser receiving end assembly, so as to ensure that the laser beam emitted by the laser emitter is parallel to the ground, which is conducive to ensuring the accuracy of the detection results. Levels include, but are not limited to, vials.

[0099] Embodiment 1 of wafer leveling method:

[0100] A wafer leveling method, using wafer cleaning equipment and the wafer leveling device of Embodiment 2 or Embodiment 3 of the above-mentioned wafer leveling device, the wafer cleaning device includes a control center and a wafer for placing wafers A round carrier, including the following steps,

[0101] Install the wafer leveler on the wafer cleaning equipment so that the laser transmitter 1 and the laser receiver 2 are respecti...

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PUM

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Abstract

The present invention discloses a laser emitter, a laser receiver, a wafer leveler and a wafer leveling method, and relates to the technical field of a level detecting device, in order to solve the technical problem of a lack of degree of freedom existing in the prior art. The laser emitter comprises a laser emitting end assembly and a first mounting base. The first mounting base comprises a fixing base, a connecting member, a connecting seat and a mounting bracket; the laser emitting end assembly is connected with the fixing base and can emit the laser beam toward the first direction; the fixing base is connected with the connecting seat through the connecting member, and the fixing base can rotate in the second direction; and the connecting seat is connected with the mounting bracket, and the connecting seat can move up and down along the third direction and can rotate in the third direction, wherein the first direction, the second direction, and the third direction are perpendicularto each other, and the third direction is a length direction of the mounting bracket. According to the technical scheme of the present invention, a high degree of freedom can be ensured, and the accuracy of the detection result is high.

Description

technical field [0001] The invention relates to the technical field of level detection devices, in particular to a laser transmitter, a laser receiver, a wafer leveling device and a wafer leveling method. Background technique [0002] In the prior art, semiconductor wafers, that is, wafers, are cleaned by wafer cleaning equipment after undergoing etching or dopant implantation processes. The wafer cleaning equipment in the prior art includes a plurality of process tanks, that is, wafer carriers for placing wafers, and each process tank is responsible for a cleaning process, such as ultrasonic / megasonic cleaning tanks, brushing tanks, drying tanks, etc. . In order to achieve the best process effect in each process tank, the wafer can be placed in a horizontal position or a vertical position. Among them, when the wafer is placed horizontally in the drying tank, the rotation speed of the wafer can reach more than 2000 rpm. At this time, a wafer leveler is required to detect t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66H01L21/67
CPCH01L21/67028H01L21/67259H01L22/12H01L22/20
Inventor 胡孝伟陶利权严雪冬张金环刘志伟
Owner BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD