Inductor layout having improved isolation through blocking of coupling between inductors, and integrated circuit device using same

A technology of integrated circuits and inductors, which is applied in the field of signal processing performance, can solve the problems of magnetic coupling of inductors and lower RFIC performance, and achieve the effects of reduced area, superior performance, and reduced magnetic coupling

Inactive Publication Date: 2019-03-01
KOREA ADVANCED INST OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, the inter-inductor magnetic coupling between the PA that transmits the high output in the RFIC and the LC oscillator that generates the carrier frequency is a factor that degrades the performance of the RFIC
In addition, not only the existing voltage-controlled oscillator (VCO), but also the digitally controlled oscillator (DCO) that has been actively used recently has a problem of magnetic coupling between inductors.

Method used

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  • Inductor layout having improved isolation through blocking of coupling between inductors, and integrated circuit device using same
  • Inductor layout having improved isolation through blocking of coupling between inductors, and integrated circuit device using same
  • Inductor layout having improved isolation through blocking of coupling between inductors, and integrated circuit device using same

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Embodiment Construction

[0028] The specific structural and functional descriptions of the embodiments of the present invention disclosed herein are only for the purpose of illustrating the embodiments of the present invention. Embodiments of the present invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein.

[0029] The invention is susceptible to various modifications and can take various forms. Specific embodiments are illustrated in the drawings and described in detail herein. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but to include all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

[0030] It will be understood that, although the terms first, second, third etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one elem...

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Abstract

Disclosed are an inductor layout having improved isolation through the blocking of a magnetic field coupling between inductors, and an integrated circuit device using the same. A second inductor coilis arranged so as to be spaced from a first inductor coil in the vicinity thereof in the horizontal direction, and a conductor loop is arranged in parallel on an upper part of the first inductor coil.The conductor loop offsets a part of a magnetic flux of a first time-varying magnetic field by means of a magnetic flux of a second magnetic field generated by an induced current flowing through an interlinkage with the magnetic flux of the first time-varying magnetic field generated from the second conductor coil, thereby increasing isolation between the first inductor coil and the second inductor coil, and blocking magnetic field coupling therebetween. The inductor layout improves overall performance of an RFIC by reducing magnetic field coupling between an inductor of a power amplifier (PA) and an inductor of an oscillator, when applied to the integrated circuit device such as the RFIC, so as to allow two blocks to be arranged at a close distance, thereby enabling a micro-RFIC to be implemented.

Description

technical field [0001] The present invention relates to a technique for reducing the coupling between magnetic inductors to improve insulation therebetween, and more particularly, to a technique for protecting small integrated circuit (IC) devices including inductors such as radio frequency integrated circuits ( A technology that protects inductors in RFICs from external magnetic fields, thereby miniaturizing IC devices and improving signal processing performance of IC devices. Background technique [0002] The problem of magnetic coupling between inductors is an old problem for RFICs mainly used in radar and wireless communications. Magnetic field coupling mainly through the substrate is a problem on which many studies have been conducted. In the past, the size of RFIC was relatively large and enough distance could be kept between the inductors, so that the magnetic coupling inside the chip could be avoided to a certain extent. [0003] Recently, in order to meet the need...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/38H01F27/36H03B5/20H03F1/34
CPCH01F27/38H03F1/34H01F17/0006H01F27/289H01F2017/008H03B5/1228H03B5/1215H03B5/1265H01L23/5227H01L28/10H04B5/0075H03F3/195H03F1/565H01F27/363H01F27/36H01F27/2804H01F38/14
Inventor 俞炯濬刘相善李康润
Owner KOREA ADVANCED INST OF SCI & TECH
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