Substrate processing device
A substrate processing apparatus and a substrate processing technology are applied in the directions of gas processing, separation method, cleaning method using liquid, etc., which can solve the problems of low processing quality and inability to fully discharge the ambient gas of the cup member 310, etc., so as to improve the quality and suppress the Degraded effect
Active Publication Date: 2019-03-01
DAINIPPON SCREEN MTG CO LTD
View PDF16 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
When the amount of exhaust gas allocated to the substrate processing apparatus 500 by the exhaust equipment 910 is insufficient to satisfy the required exhaust amount of the above-mentioned substrate processing apparatus 500, the substrate processing apparatus 500 cannot sufficiently exhaust the ambient gas in the cup member 310, and therefore If substrate processing is performed, processing quality is low
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0050] Hereinafter, embodiments will be described with reference to the drawings. The following embodiment is an example after embodying the present invention, and is not an example for limiting the technical scope of the present invention. In addition, in each figure referred to below, the size and number of each part may be exaggerated or simplified for easy understanding. In addition, in each figure, the same reference numerals are given to parts having the same structure and function, and repeated descriptions are omitted in the following description. The up-down direction is the vertical direction, and the side with respect to the spin chuck substrate is up.
[0051] (1. Substrate processing apparatus 100)
[0052] Reference figure 1 The structure of the substrate processing apparatus 100 will be described. figure 1 It is a side cross-sectional view schematically showing the substrate processing apparatus 100 of the first embodiment. figure 2 It is an enlarged side sectio...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The objective of the present invention is to sufficiently exhaust the atmosphere in a chamber even when the exhaust amount of external exhaust equipment is insufficient. In order to achieve the objective, a substrate processing device is provided with: a chamber; a substrate processing mechanism that has a holding member capable of holding a substrate in a substantially horizontal state and is housed in the chamber, and discharges processing fluid onto the substrate held by the holding member in order to process the substrate; a joint pipe that has a lower opening provided below the holding member and facing the inside of the chamber and an upper opening provided above the holding member and facing the inside of the chamber, and is disposed such that at least a part thereof from the loweropening to the upper opening passes through the outside of the chamber; and an air flow generator that is provided on the joint pipe, wherein the air flow generator circulates the atmosphere in the chamber by discharging the atmosphere, which contains a specific gas, in the chamber from the lower opening to the joint pipe to allow the atmosphere to pass through the joint pipe, thereby introducingthe atmosphere again into the chamber via the upper opening so that the downflow of the atmosphere occurs in the chamber.
Description
Technical field [0001] The present invention relates to a substrate for semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for plasma displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, glass substrates for photomasks, substrates for solar cells, etc. (hereinafter , Just referred to as "substrate") a substrate processing device that performs processing. Background technique [0002] As such a substrate processing device, for example, image 3 The substrate processing apparatus 500 is shown. This device has four chambers (housings) 1210 overlapping in the vertical direction. In each chamber 1210, a holding member (not shown) for holding a substrate (not shown) horizontally and a cup member 310 surrounding the holding member are provided. This apparatus performs substrate processing by ejecting a processing liquid from a nozzle (not shown) to the substrate held by the holding member, ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304
CPCB08B15/02H01L21/67178H01L21/67051H01L21/67017H01L21/67253F16L55/24H01L21/6715B01D2279/35B01D46/0041B01D46/0017B08B3/022
Inventor 沖田展彬西村让一
Owner DAINIPPON SCREEN MTG CO LTD