Fingerprint sensor chip packaging structure
A sensing chip and packaging structure technology, applied in the direction of acquiring/arranging fingerprints/palmprints, instruments, circuits, etc., can solve the problems of warping of the fingerprint sensing module 20 and loss of mechanical strength of the fingerprint sensing module 20, etc.
Inactive Publication Date: 2020-06-05
PRIMAX ELECTRONICS LTD
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Problems solved by technology
In today's trend of continuous pursuit of thinner and lighter electronic devices, although the thickness of the fingerprint sensing module 20 packaged by the existing packaging technology can be as thin as 770 μm, however, due to the shrinkage characteristics of the packaging material, it may cause fingerprint sensing. The phenomenon of warping of the sensor module 20 and the loss of the proper mechanical strength of the fingerprint sensor module 20
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[0056] The advantages and features of the present invention and methods for attaining the same will be more easily understood by more detailed description with reference to exemplary embodiments and accompanying drawings. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. On the contrary, for those skilled in the art, these embodiments are provided to make this disclosure more thorough, comprehensive and fully convey the scope of the present invention.
[0057] First, see figure 2 as shown, figure 2 It is a three-dimensional exploded view of the package structure of the fingerprint sensing chip provided by the present invention. At figure 2 Among them, the fingerprint sensing chip packaging structure 10 includes: a fingerprint sensing chip 11 , a substrate 12 , a cover plate 13 , a flexible printed circuit (FPC, FPC) 14 and a reinforcing plate 15 .
[0058] read on figure 2 , the finger...
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Abstract
The present invention provides a fingerprint sensing chip packaging structure, including a substrate, a fingerprint sensing chip, a cover plate and a flexible circuit board, the substrate has a first surface, a second surface and a through opening, the second surface includes a The groove and the second metal contact, the groove is used to accommodate the first metal contact; the fingerprint sensing chip has an upper surface and a lower surface, which is arranged in the through opening and has a welding pad on the lower surface; the cover plate is fixed on the The first surface of the substrate covers the upper surface of the fingerprint sensing chip; the flexible circuit board is arranged on the second surface of the substrate, and the surface of the flexible circuit board has a third metal contact, and the third metal contact corresponds to the second metal contact , and electrically connected to the second metal contact; wherein, the welding pad is electrically connected to the first metal contact through a wire. Substrate encapsulation replaces epoxy molding resin encapsulation, so that the fingerprint sensor chip encapsulation structure can be thinned while still maintaining good mechanical strength, and can avoid appearance warping.
Description
technical field [0001] The invention relates to the application field of chip packaging, in particular to a packaging structure for fingerprint sensing chips. Background technique [0002] With the advancement of technology, fingerprint identification modules with fingerprint identification functions have also been widely installed in electronic devices, and have become one of the standard configurations of electronic devices. The user can identify the identity through the fingerprint identification module to further unlock the electronic device or perform software interface operations. [0003] existing technologies such as figure 1 as shown, figure 1 It is a cross-sectional view of an existing fingerprint sensing chip package structure. At figure 1 Among them, the fingerprint sensing module 20 is made of a flat grid array packaging (Land Grid Array, LGA) technology package, including: a fingerprint sensing chip 21, a substrate 22, and a fingerprint sensor covering the ...
Claims
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IPC IPC(8): H01L23/31H01L23/52G06K9/00
CPCH01L23/52H01L23/3114H01L23/3121G06V40/12H01L2924/181H01L2224/48227H01L2224/48091H01L2924/00012H01L2924/00014
Inventor 卢崇义
Owner PRIMAX ELECTRONICS LTD