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PCB production mold

A mold and mold group technology, applied in the electronic field, can solve problems such as low substrate yield, high temperature resistance, and thermal insulation design that do not meet the requirements, and achieve the effect of temperature stability

Pending Publication Date: 2019-03-08
SHENZHEN FRD SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In actual operation, this solution requires a higher temperature during the processing and molding process of the base material, and the conventional mold design does not meet the requirements in terms of high temperature resistance and heat preservation design, resulting in a low yield of the produced substrate

Method used

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  • PCB production mold

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Embodiment Construction

[0016] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0017] refer to figure 1 , is a schematic structural diagram of a PCB production mold according to an embodiment of the present invention;

[0018] In the embodiment of the present invention, the targeted circuit board substrate is a substrate material containing PPS material, specifically, a circuit board substrate containing a certain proportion of PPS and GF may be used.

[0019] In the embodiment of the present invention, the circuit board substrate containing PPS and GF materials is subjected to injection molding processing, and the injection molding processing is performed according to design requirements.

[0020] The PCB production mold provided by the embodiment of the present invention includes a first mold set 11 and a...

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Abstract

The invention provides a PCB production mold. The mold comprises a first mold set and a second mold set, wherein the first mold set and the second mold set are each connected with at least one heat insulation plate; the mold further comprises at least one guide sleeve, an oil temperature circulation input pipe and an oil temperature circulation output pipe; the guide sleeve is located on the innerside of the first mold set, and the oil temperature circulation input pipe and the oil temperature circulation output pipe are located on the inner side of the second mold set; and the first mold setand the second mold set are closed to form a material forming cavity. According to the mold, the temperature stability in the forming cavity and the high temperature resistance of the mold assembly are ensured by adopting the designs of the heat insulation plates and the oil temperature circulation.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a PCB production mold. Background technique [0002] With the continuous development of the electronic technology field, the demand for various circuit boards is increasing, and the antenna oscillators of some equipment are also processed and produced in the form of circuit boards. However, the substrate used in the processing of the antenna vibrator has higher requirements on its electromagnetic characteristics than other circuit boards, and requires lower magnetic properties to prevent interference with sending and receiving signals during use. [0003] In order to make the magnetism of the antenna vibrator as low as possible, most of the substrates will use a certain proportion of PPS and GF raw materials for injection molding of the substrate. [0004] In actual operation, this solution requires a higher temperature during the processing and molding process of the substr...

Claims

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Application Information

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IPC IPC(8): B29C45/73
CPCB29C45/7312
Inventor 陈凤
Owner SHENZHEN FRD SCI & TECH
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