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Low-hydroxyl phosphorus-containing epoxy resin, composition for copper-clad plate and preparation method thereof

A technology for epoxy resin and resin for copper clad laminates, which is applied in the field of low-hydroxy phosphorous-containing epoxy resins and compositions for copper clad laminates and their preparation, and raw materials for copper clad laminates, can solve the problems affecting the stability, dielectric constant, etc. of copper clad laminates. The problems of high dielectric loss and high water absorption can achieve the effect of reducing hydroxyl content, polarity and hydroxyl content.

Active Publication Date: 2019-03-08
SICHUAN DONGFANG INSULATING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the existence of a large number of hydroxyl groups, the polarity of the final molecular system is strong, so the dielectric constant and dielectric loss are high, while the hydroxyl equivalent (about 1000) is low. Because the hydroxyl group is highly hydrophilic, the water absorption rate of the resin after curing High, which affects the stability of copper clad laminates in humid environments

Method used

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  • Low-hydroxyl phosphorus-containing epoxy resin, composition for copper-clad plate and preparation method thereof
  • Low-hydroxyl phosphorus-containing epoxy resin, composition for copper-clad plate and preparation method thereof
  • Low-hydroxyl phosphorus-containing epoxy resin, composition for copper-clad plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2-1～2-8

[0057] Example 2-1~2-8 Formulation Raw Material Consumption Table of Resin Composition for Copper Clad Laminate (Unit: kg)

[0058]

[0059]

[0060] Example 2-1 to 2-8 Sheet performance results of the resin composition for copper-clad laminates

[0061]

Embodiment 3

[0063] A low-hydroxyl phosphorus-containing epoxy resin is produced by mixing novolac epoxy resin, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO for short) and catalyst A Phosphorus-containing epoxy, then add isocyanate for further reaction to obtain low-hydroxyl phosphorus-containing epoxy resin;

[0064] The chemical structural formula of described novolak epoxy resin is:

[0065] In the formula: R is H, -CH 3 , n=1~7;

[0066] The catalyst A is tetraethylammonium bromide, tetramethylammonium chloride, triphenylphosphine, ethyltriphenylphosphine bromide, ethyltriphenylphosphine iodide, and ethyltriphenylphosphine acetate One or more mixtures;

[0067] The isocyanate is one or a mixture of two or more of diphenylmethane diisocyanate (abbreviated as MDI), toluene diisocyanate (abbreviated as TDI), and hexamethylene isocyanate (abbreviated as HDI).

Embodiment 4

[0069] The preparation method of low-hydroxyl phosphorus-containing epoxy resin, the steps are: 40 parts by mass of novolac epoxy resin, 10 parts by mass of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (abbreviated as DOPO) into the reactor (for example: three-necked flask, reaction kettle, etc.), heated to 110 ° C, stirred until 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (referred to as DOPO ) (completely) melted, add 0.1 parts by mass of catalyst A, stir and heat up to 140°C, and stir and react at this temperature for 1 hour, add 5 parts by mass of isocyanate, and then heat up to 170°C and stir for 1 to 6 hours, when When the hydroxyl equivalent is greater than or equal to 5000, lower the temperature, add 25 parts by mass of propylene glycol methyl ether and butanone mixed solvent, and stir evenly to obtain a low-hydroxyl phosphorus-containing epoxy resin.

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Abstract

The invention discloses a low-hydroxyl phosphorus-containing epoxy resin, a composition for a copper-clad plate and a preparation method thereof. The preparation method is characterized by including:mixing phenolic epoxy resin, 9, 10-dihydrogen-9-oxa-10-phosphaphenanthrene-10-oxide and a catalyst A for reaction to generate phosphorus-containing epoxy, and adding isocyanate for reaction to obtainlow-hydroxyl phosphorus-containing epoxy resin. The composition is prepared by mixing, by mass, 5-10 parts of organic silicone resin, 3-6 parts of tri(2-ethoxy) isocyanurate, 5-10 parts of linear phenolic resin, 5-10 parts of unsaturated polyester imide resin, 5-10 parts of unsaturated benzoxazine resin, 40-50 parts of the low-hydroxyl phosphorus-containing epoxy resin, 0.1-0.5 part of imidazole catalyst and 10-15 parts of butanone.

Description

technical field [0001] The invention belongs to flame-retardant epoxy resin for copper-clad laminates and its preparation, and relates to a low-hydroxyl phosphorus-containing epoxy resin, a composition for copper-clad laminates and a preparation method thereof. The low-hydroxyl phosphorus-containing epoxy resin and the composition for copper clad laminates of the present invention have the characteristics of low hydroxyl content, low water absorption, low dielectric constant, low dielectric loss, etc., and are especially suitable as raw materials for copper clad laminates. Background technique [0002] Now all kinds of organic resins are used in all walks of life, among which epoxy resins are widely used, especially phosphorus-containing epoxy resins, which are valued by more and more fields because of their flame retardancy. In the copper clad laminate industry, although phosphorus-containing epoxy resin has the advantages of low toxicity, low smoke, high flame retardant ef...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/14C08G18/58C08L63/04C08L83/04C08L61/06C08L61/34C08L67/06
CPCC08G18/58C08G59/1477C08G59/1488C08G59/1494C08L63/04C08L2201/02C08L2205/035C08L83/04C08L61/06C08L61/34C08L67/06
Inventor 叶伦学唐文东黄杰李建学
Owner SICHUAN DONGFANG INSULATING MATERIAL