An integrated circuit board pressing device

Abstract

The invention discloses a pressing device for an integrated circuit board, which comprises a box body, a mounting rotating mechanism, a first hydraulic cylinder, a hydraulic oil tank, a slot hole, an electric control box, a control board, a PLC controller, a support plate, a support rod, an upper Die, hot plate, heat pipe, temperature sensor, groove, heating resistor, fan and hydraulic pump, the two sides of the box are symmetrically provided with slot holes, and an electric control box is installed on one side of the box, and the electric A control panel is installed on one side of the control box, a PLC controller is installed inside the electric control box, and a rotating mechanism is installed on the top of the box body; the hydraulic oil tank of the present invention is provided with equipment that can regulate the hydraulic oil temperature, which can be adjusted according to The temperature of the hydraulic oil is adjusted according to the actual situation to ensure the normal use of the hydraulic device; at the same time, the installation of the rotating mechanism can improve the overall pressing efficiency of the pressing device, and the pressing effect is good.

Description

technical field [0001] The invention relates to the field of integrated circuit board manufacturing equipment, in particular to an integrated circuit board pressing device. Background technique [0002] The integrated circuit board is a carrier for carrying integrated circuits, but it is often said that the integrated circuit board also carries the integrated circuit. The integrated circuit board is mainly composed of silica gel, so it is generally green. The integrated circuit board uses semiconductor manufacturing technology. Many transistors, resistors, capacitors and other components are made on a smaller single crystal silicon wafer, and the components are combined into a complete electronic circuit according to the method of multi-layer wiring or tunnel wiring; A pre-fluxed tinned part is heated to a temperature sufficient to melt and flow the solder. After solidification, a permanent electrical and mechanical connection device is formed between the part and the solder...

AI Technical Summary

Problems solved by technology

[0003] The existing integrated circuit board pressing device provides pressing force through the hydraulic device during use. When the hydraulic oil is used, if the temperature is too high, the viscosity of the hydraulic oil will be reduced, and the lubricity will be reduced, which will make the oil pump and hydraulic components The wear and tear is accelerated during work, which is easy to cause leakage. If the temperature is low, the viscosity of the hydraulic oil will increase, which will cause the movement flexibility of the hydraulic components to decrease. In severe cases, the moving components may not move and affect normal work; at the same time The overall pressing efficiency of the existing integrated circuit board pressing device is low, and the pressing effect is poor

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