Semiconductor device

一种半导体、壳体的技术，应用在半导体器件、半导体/固态器件零部件、电固体器件等方向，能够解决安装性存在问题、未考虑散热板翘曲等问题

Active Publication Date: 2019-03-12
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the technology described in Patent Document 2, it is not necessary to make the heat sink flexible, but the warpage of the heat sink is not considered, so there is a problem with the mountability of the product.

Method used

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  • Semiconductor device
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0035] Hereinafter, the first embodiment of the present invention will be described with reference to the drawings. figure 1 It is a cross-sectional view of the semiconductor device according to the first embodiment. figure 2 It is a cross-sectional view of the semiconductor device in a state where the heat sink 1 is removed. image 3 It is a bottom view of the semiconductor device with the heat sink 1 removed. Figure 4 It is a bottom perspective view of the raised portion 11b and its peripheral portion.

[0036] Such as figure 1 As shown, the semiconductor device is a power semiconductor device, and the semiconductor device has a heat sink 1, a heat sink 3, a housing 10, screws 12, a plurality of semiconductor elements 6, and a plurality of metal terminals 9.

[0037] A heat dissipation plate 3 is arranged on the upper side of the heat sink 1. More specifically, the heat-conducting material 2 is provided on the lower surface of the heat sink 3, and the heat-dissipating plate 3 is...

Embodiment approach 2

[0061] Next, the semiconductor device according to Embodiment 2 will be described. Picture 9 It is a simplified cross-sectional view of the semiconductor device according to the second embodiment in a screw-fastened state. Picture 10 It is a bottom perspective view of the boss 31 and its periphery. In addition, in the second embodiment, the same components as those described in the first embodiment are assigned the same reference numerals, and the description is omitted.

[0062] In Embodiment 2, such as Picture 9 and Picture 10 As shown, the four bosses 31 have a structure that is bent outward due to the stress when the screw 12 is tightened.

[0063] The protrusion 31 is made of, for example, resin such as PPS. The protrusion 31 is provided with a notch 31a extending in the horizontal direction on the side of the mounting hole 14b located at the peripheral portion thereof, and the notch 31a facilitates the bending of the protrusion 31. The notch 31a facilitates the bending o...

Embodiment approach 3

[0068] Next, a semiconductor device according to Embodiment 3 will be described. Picture 11 This is a bottom perspective view of the bump 41 and its peripheral portion of the semiconductor device according to the third embodiment. Picture 12 It is a cross-sectional view of the boss 41 and its peripheral part. In addition, in Embodiment 3, the same components as those described in Embodiments 1 and 2 are assigned the same reference numerals, and descriptions thereof will be omitted.

[0069] In Embodiment 3, such as Picture 11 and Picture 12 As shown, the four bosses 41 have a structure that bends outward due to the stress when the screw 12 is tightened.

[0070] The protrusion 41 is made of resin such as PPS. The convex portion 41 is provided with an inclined portion 41a that is inclined to the mounting hole 14b side with respect to the lower surface of the mounting portion 10b so that the width of the tip portion becomes smaller than the root end portion. The inclined portion ...

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PUM

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Abstract

Provided is a technique for improving product attachment. The distance between the lower end of the main body portion (3a) and the lower end of the casing (10) in a state where the semiconductor device fastens the screw (12) to the heat sink (1) via one mounting hole (14b, 14d) is set as M, the swelling amount of the swelling portion (3b) is W, and the projection height of the convex portion (11b)is T, the distance in the horizontal direction from the outer peripheral end of the casing (10) to the outer periphery of the heat dissipation plate (3) is L. The angle A formed by the imaginary line(B-B') and the imaginary line (C-C') satisfies 0<A<arctan((M+W-T) / L), the imaginary line (B-B') is an imaginary line connecting the two mounting holes (14b, 14c), and the imaginary line (C-C') is animaginary line connecting the following two points, that is, the lowest point (C) of one convex portion (11b) at the peripheral portion of one mounting hole (14b); the contact portion (C') of the bulging portion (3b) and the heat sink (1).

Description

Technical field [0001] The present invention relates to a semiconductor device, and particularly to a power semiconductor device having a power chip. Background technique [0002] For power semiconductor devices having power chips, it is very important to efficiently dissipate heat generated by the power chips to external structures such as heat sinks. When mounting the main body of the semiconductor device to the heat sink, the use of a thermally conductive material achieves efficient heat dissipation. [0003] In order to promote heat dissipation from the thermally conductive material to the heat sink, a structure is adopted in which the center portion of the heat sink on which the power chip is mounted is fastened to the heat sink by screwing (for example, refer to Patent Documents 1 and 2). [0004] Patent Document 1: Japanese Patent Application Laid-Open No. 4-233752 [0005] Patent Document 2: Japanese Publication No. 4-46552 [0006] However, in the technology described in Pate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/40
CPCH01L23/40H01L23/4006H01L23/3735H01L2224/48091H01L2224/73265H01L2924/19107H01L23/041H01L2924/00014H01L23/04H01L23/433H01L2023/4025H01L2023/4043H01L2023/4068H01L2023/4087
Inventor 冈田一也村冈宏记增田晃一清水康贵泉将志
Owner MITSUBISHI ELECTRIC CORP
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