Off-line detection method for wafer surface particles

A surface particle and detection method technology, which is applied in semiconductor/solid-state device testing/measurement, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as reducing product yield, increasing production cost, and wafer product danger. Improve the yield rate, improve the signal strength, and reduce the effect of production costs

Inactive Publication Date: 2019-03-15
SHANGHAI HUALI MICROELECTRONICS CORP
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Problems solved by technology

This situation is very dangerous for wafer products, and it i

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  • Off-line detection method for wafer surface particles
  • Off-line detection method for wafer surface particles
  • Off-line detection method for wafer surface particles

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[0032] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0033] It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other if there is no conflict.

[0034] The present invention will be further described below with reference to the drawings and specific embodiments, but it is not a limitation of the present invention.

[0035] An illustrative embodiment of the present invention, such as figure 1 As shown, an offline detecti...

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Abstract

The invention relates to an offline detection method for wafer surface particles. The method comprises the following steps of: S1, providing an unproductive wafer in an off-line state, and forming a film layer on a semiconductor substrate of the unproductive wafer; S2, simulating a normal production process, and scattering a plurality of particles on the upper surface of the film layer; S3, etching the film layer to form a plurality of tower structures, wherein the upper surface of each tower structure is covered by one the particle; S4, detecting the tower structures detected by the step S3 to obtain electrical signals of the tower structures; S5, carrying out calculation according to the electrical signals to obtain positions of the particles on the semiconductor substrate, a size of each particle and a number of the particles; and S6, improving the normal production process. The method has the advantages of forming tower structures on NPW through simulating the production process ofwafer products, and effectively improving the signal intensity of fine particles.

Description

technical field [0001] The invention relates to the technical field of semiconductor detection, in particular to an off-line detection method for wafer surface particles. Background technique [0002] With the development of semiconductor technology, the critical dimensions of the semiconductor process are getting smaller and smaller, and the line width is getting smaller and smaller, and the requirements for processing machines are getting higher and higher. [0003] During the wafer production process, many tiny particles (less than 0.1 μm in size) will fall on the wafer surface on the production line. As the width ratio increases, the defect signal of the particles will be displayed. At this time, the particles have stayed on the surface of the wafer for at least 6 hours, and some may even stay for 24 hours. This situation is very dangerous to wafer products, and it is easy to reduce product yield and increase production costs. [0004] Therefore, there is an urgent nee...

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Application Information

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IPC IPC(8): H01L21/66H01L21/67
CPCH01L21/67288H01L22/12H01L22/20
Inventor 黄莉晶何广智倪棋梁
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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