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Light-emitting diode micro-devices and display panels

A technology of light-emitting diodes and display panels, which is applied in semiconductor devices, electrical solid-state devices, electrical components, etc., can solve the problems of restricting the development of Micro-LEDs, low transfer efficiency, and waste of raw materials, so as to save raw materials and production costs and improve product quality. Yield rate and productivity improvement effect

Active Publication Date: 2021-03-16
HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the precise transfer of many small light-emitting diodes involved in mass transfer, and the number of transfers is large, the transfer process takes a long time, the transfer efficiency is low, and the light-emitting diode particles are prone to damage during the transfer process, and the damaged light-emitting diode particles need to be repaired separately Processing, low product yield and waste of raw materials
The problem faced by mass transfer is also a major problem restricting the development of Micro-LED

Method used

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  • Light-emitting diode micro-devices and display panels
  • Light-emitting diode micro-devices and display panels

Examples

Experimental program
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Effect test

Embodiment 1

[0029] Such as figure 1 As shown, this embodiment provides an LED micro-device 100 , including a light emitting chip layer 3 , a first conductive layer 2 , a second conductive layer 4 , a first transparent substrate 1 and a transparent conductive layer 5 . The first conductive layer 2 is disposed on one surface of the light emitting chip layer 3 , and the second conductive layer 4 is disposed on the other surface of the light emitting chip layer 3 . The first conductive layer 2 covers the first transparent substrate 1 . The transparent conductive layer 5 is arranged on the second conductive layer 4 and is electrically connected to the second conductive layer 4. It is an indium tin oxide semiconductor transparent conductive film (ITO conductive glass). In order to reduce the crosstalk between pixels, transparent conductive The connecting surface of the layer 5 to the second conductive layer 4 is patterned.

[0030] The light-emitting wafer layer 3 is cut from a wafer with sev...

Embodiment 2

[0034] Such as figure 2 As mentioned above, this embodiment provides a display panel 200 including a group of LED micro-devices 100 as described in Embodiment 1, and all LED micro-devices 100 in each group are stacked up and down.

[0035] Each set of LED micro-device 100 includes LED micro-device 100 with red light-emitting wafer layer 31 , LED micro-device 100 with green light-emitting wafer layer 32 and LED micro-device 100 with blue light-emitting wafer layer 33 . The LED micro-device 100 with the green light-emitting wafer layer 32 is disposed on the LED micro-device 100 with the blue light-emitting wafer layer 33 . The LED micro-device 100 with the red light-emitting wafer layer 31 is disposed on the LED micro-device 100 with the green light-emitting wafer layer 32 .

[0036] The display panel 200 provided in this embodiment further includes a second transparent substrate 7 and three driving circuits 8 . The second transparent substrate 7 is a glass substrate, which i...

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Abstract

A light-emitting diode micro-device (100), comprising a light-emitting wafer layer (3), a first conductive layer (2), a second conductive layer (4), a first transparent substrate (1), and a transparent conductive layer (5). The first conductive layer (2) is disposed on a surface of the light-emitting wafer layer (3). The second conductive layer (4) is disposed on the other surface of the light-emitting wafer layer (3). Several thin film transistors (6) are distributed on a surface of the first transparent substrate (1), and the first conductive layer (2) covers the thin film transistors (6) and is electrically connected to the thin film transistors (6). A display panel (200) comprises at least one group of light-emitting diode micro-devices (100), a second transparent substrate (7), and a drive circuit (8) correspondingly connected to each light-emitting diode micro-device (100). No massive movement is needed to prepare the described light-emitting diode micro-device (100), which saves a lot of time, increases production efficiency, increases product yield, and saves on raw materials and production costs.

Description

technical field [0001] The invention relates to the display field, in particular to a light-emitting diode micro-device and a display panel. Background technique [0002] Micro-LED (Micro Light-Emitting Diode, miniature light-emitting diode) technology is a popular new display device technology today. Its principle is to thin, miniaturize and array the LED structure design, and its size is only in the range of 1 to 10 meters. about. Micro-LED has many advantages. It has the advantages of high efficiency, high brightness, high reliability and fast response time of LED, and has the characteristics of self-illumination without backlight, and has the advantages of energy saving, small size and simple mechanism. [0003] The first step of the existing Micro-LED technology is to fabricate a micron-sized light-emitting diode array on a sapphire-like substrate. The second step is to transfer the LED array to the driver board. Since the number of LED particles to be transferred is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12
CPCH01L27/1214
Inventor 熊充
Owner HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
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