A light emitting diode and packaging method thereof

A technology for light-emitting diodes and packaging methods, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as affecting the reliability of LEDs and disconnection of gold wires, so as to reduce the impact, reduce the probability of disconnection, and improve reliability. Effect

Active Publication Date: 2020-05-19
HC SEMITEK ZHEJIANG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The embodiment of the present invention provides a light-emitting diode and its packaging method, which can solve the problem in the prior art that the disconnection of the gold wire affects the reliability of the LED

Method used

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  • A light emitting diode and packaging method thereof
  • A light emitting diode and packaging method thereof
  • A light emitting diode and packaging method thereof

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Embodiment Construction

[0032] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0033] An embodiment of the present invention provides a light emitting diode. figure 1 A schematic structural diagram of a light emitting diode provided by an embodiment of the present invention. see figure 1 , the light emitting diode includes a packaging bracket 10, a light emitting diode chip 20, a metal wire 30 and a packaging colloid 40 doped with phosphor. The center of the upper surface of the packaging support 10 is provided with a recessed portion 11, the light emitting diode chip 20 is fixed in the recessed portion 11, and the distance between the plane where the upper surface of the light emitting diode chip 20 is located and the plane where the upper surface of the packaging support 10 is located is less than or equal to...

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Abstract

The invention discloses a light-emitting diode and a packaging method thereof, belonging to the technical field of semiconductors. The light-emitting diode includes a package bracket, a light-emitting diode chip, a metal wire, and a packaging colloid mixed with phosphor powder. The center of the upper surface of the package bracket is provided with a depression, and the light-emitting diode chip is fixed in the depression. The distance between the plane where the upper surface of the light-emitting diode chip is located and the plane where the upper surface of the packaging bracket is located is less than or equal to a set value; the metal wire is linear, and the two ends of the metal wire are respectively connected to the The light-emitting diode chip is electrically connected to the packaging bracket; the packaging colloid is arranged on the light-emitting diode chip and the metal wire. The embodiments of the present invention can greatly reduce the probability of disconnection of metal wires and improve the reliability of LEDs.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a light emitting diode and a packaging method thereof. Background technique [0002] A light-emitting diode (English: Light Emitting Diode, referred to as: LED) is a semiconductor electronic component that can emit light. Since gallium nitride (GaN)-based LEDs were successfully developed by Japanese scientists in the 1990s, the technology of LEDs has been continuously improved, the brightness of LEDs has been continuously improved, and the application fields of LEDs have become wider and wider. As a high-efficiency, environmentally friendly and green new-generation solid-state lighting source, LED has the advantages of low voltage, low power consumption, small size, light weight, long life, and high reliability. It is rapidly and widely used in traffic lights, automotive interior and exterior lights, urban Landscape lighting, mobile phone backlight, outdoor full-color dis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/10H01L33/48H01L33/50H01L33/52H01L33/62
CPCH01L33/10H01L33/48H01L33/502H01L33/52H01L33/62H01L2224/32245H01L2224/48101H01L2224/48247H01L2224/48464H01L2224/73265H01L2924/00
Inventor 兰叶顾小云
Owner HC SEMITEK ZHEJIANG CO LTD
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