LED circuit board with black FR4 substrate and preparation method

A LED circuit board, black technology, applied in the direction of printed circuit manufacturing, circuit substrate materials, multi-layer circuit manufacturing, etc., can solve the problem that the process is difficult to meet the complete requirements, achieve product diversification, improve light efficiency, eliminate surface The effect of color differences

Inactive Publication Date: 2019-03-22
通元科技(惠州)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The current process is difficu...

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  • LED circuit board with black FR4 substrate and preparation method
  • LED circuit board with black FR4 substrate and preparation method
  • LED circuit board with black FR4 substrate and preparation method

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Embodiment Construction

[0048] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0049] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly co...

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Abstract

The invention discloses an LED circuit board with a black FR4 substrate and a preparation method. The LED circuit board comprises a black FR4 substrate, and is characterized in that a black prepreg islaminated on the black FR4 substrate, a copper foil is laminated on the black prepreg, and the laminated LED circuit board is provided with a plurality of through holes and a circuit pattern playinga role of electrical conduction. According to the LED circuit board, the LED circuit board manufactured by laminating the black FR4 base material and the black prepreg is adopted, the color differenton the surface of the circuit board is eliminated, a light efficiency problem of LED lamp beads can be effectively improved, a problem of inconsistent ink color on the surface when the LED lamp is notturned on is solved, and the appearance beauty of an LED display screen is improved. According to the preparation method of the LED circuit board, a multilayer and multistage circuit board can be manufactured, LED products with ultra-small spacing are enabled to realize product diversity, and the application space of COB (Chip on Board) packaged LED and small-spacing LED products in multiple fields such as education, medical treatment, monitoring centers and radio and television media is further expanded.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to an LED circuit board with a black FR4 substrate and a preparation method thereof. Background technique [0002] COB packaging is chip On board, which is to adhere the bare chip to the interconnection substrate with conductive or non-conductive adhesive, and then perform wire bonding to realize its electrical connection. Compared with traditional SMD LED packaging, COB packaging has advantages in terms of manufacturing efficiency, low thermal resistance, light quality, application, and cost, especially in small-pitch display products below 1.25mm. With the emergence of COB technology, major LED manufacturers have jointly developed higher-density, high-precision circuit boards with upstream PCB manufacturers, correspondingly developing from conventional four- and six-layer through-hole circuit boards to eight-layer second-order, The design of circuit board...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/03H05K3/42H05K3/46H01L33/58H01L33/62
CPCH01L33/58H01L33/62H05K1/0298H05K1/0366H05K3/429H05K3/4626
Inventor 陈志宇乔鹏程赵宏静
Owner 通元科技(惠州)有限公司
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