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Transferable logic chip based on mechanical peeling and its preparation method

A logic chip and mechanical stripping technology, applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as poor compatibility, complicated growth process, and inability to achieve mass production of devices, so as to improve spectrum utilization, broaden application fields, and realize The effect of being flexible and wearable

Active Publication Date: 2020-05-05
NANJING UNIV OF POSTS & TELECOMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The use of the sacrificial layer can certainly solve the substrate transfer, but its growth process is complicated, and it is not compatible with the traditional process, so it cannot realize the mass production of the device

Method used

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  • Transferable logic chip based on mechanical peeling and its preparation method
  • Transferable logic chip based on mechanical peeling and its preparation method
  • Transferable logic chip based on mechanical peeling and its preparation method

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Embodiment Construction

[0036] The present invention will be further described below in conjunction with embodiment and accompanying drawing.

[0037] figure 1 , figure 2 Front and top views of the micron-scale transferable logic chip based on mechanical lift-off of the present invention are given.

[0038]The chip uses silicon substrate nitride as a carrier, and includes an epitaxial buffer layer 2 on a silicon substrate layer 1, an n-GaN layer 3 disposed on the epitaxial buffer layer 2, and an n-GaN layer disposed on the n-GaN layer 3. Multiple pairs of suspended p-n junction quantum well devices and suspended waveguides; the p-n junction quantum well devices include, from bottom to top, an n-electrode 8 on the n-GaN layer 3, an InGaN / GaN multi-quantum well 5 and an InGaN p-GaN layer 6 and p-electrode 7 on the GaN multiple quantum well 5 . A cavity is provided below the n-GaN layer 3 through the silicon substrate layer 1, the epitaxial buffer layer 2 to the n-GaN layer 3, so that the p-n juncti...

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Abstract

The invention discloses a transferable logic chip based on mechanical stripping and a preparation method thereof. The logic chip includes multiple pairs of p-n junction quantum wells and suspended GaN waveguides connecting the p-n junction quantum wells. Logical AND operations and logical OR operations can be realized between the multiple pairs of p-n junction quantum wells. The p-n junction quantum well can not only transmit optical signals to the outside, but also detect optical signals in space, and can also detect optical signals in space while emitting light, thereby realizing full-duplex communication. The invention adopts the traditional semiconductor processing technology to realize the transferable logic thin film chip for the first time. After the device is peeled off, it is transferred to a flexible carrier and can be used in the fields of communication, lighting, intelligent display, logic operation and sensing.

Description

technical field [0001] The invention belongs to the field of information materials and devices, and relates to a transferable logic chip and its preparation technology. Background technique [0002] At present, as far as InGaN / GaN multi-quantum well materials are concerned, there are mainly three transfer methods: laser lift-off, mechanical lift-off and chemical etching. Laser lift-off is to use laser to directly remove the substrate of the LED wafer, and then transfer the LED to other substrates. This method is convenient and simple to use. It is often used on sapphire substrates, but it is easy to cause damage to the LED, affecting its threshold voltage and light output. efficiency. Chemical etching first needs to grow a sacrificial layer that is easy to peel off on the initial substrate, grow the LED structure on the sacrificial layer, and transfer the LED structure through the sacrificial layer that is easy to peel off under the action of an external force. This method ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/02H01L33/00
CPCH01L33/0093H01L33/02
Inventor 施政王永进蒋燕高绪敏袁佳磊
Owner NANJING UNIV OF POSTS & TELECOMM