A connecting wire dipping tin process
A technology of connecting wire and tin dipping, which is applied in the field of tin dipping, can solve the problems of long climbing length and difficult to control, and achieve the effect of easy length.
Active Publication Date: 2021-02-09
SUZHOU LIFA ELECTRONICS
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Problems solved by technology
[0002] The structure of the connecting wires used on electronic equipment is to protect the sheath and the core wire from the outside to the inside. In order to ensure the welding quality between the connecting wire and the electronic components and meet a certain high-frequency performance, the end of the connecting wire is often dipped Tin, in the traditional tin dipping process, the flux is usually dipped first, and then the tin is dipped, but when this method is dipped in tin, the liquid tin will quickly climb up the wire, and the climbing length is longer, which is not necessary. Easy to control; for this reason, we propose a tinning process for connecting wires to solve the above problems
Method used
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Embodiment Construction
[0014] The following clearly and completely describes the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0015] In an embodiment of the present invention, a connecting wire dipping tin process includes the following steps:
[0016] A. Remove the coating from the end of the connecting wire to be tinned, and peel off the coating at one end of the connecting wire through the stripping mechanism;
[0017] B. Select two jigs and put them on the operating table. One jig is equipped with a tin inhibitor tank, and the other jig is equipped with a storage tank. The jig of the storage tank is connected to a heating The device heats the tin mate...
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The invention discloses a connecting wire dipping tin process, which comprises the following steps: A. remove the coating from the end of the connecting wire to be tinned; B. select two fixtures, put the two fixtures on the operating table, and one A tin inhibitor tank is provided on the jig, and a storage tank is provided on the other jig; C. Put the tin inhibitor in the tin inhibitor tank in step B, and put tin material in the storage tank; D. Put In step A, remove the jacket end and insert it into the tin resist tank; E. Insert the processed connecting wire in step D into the storage tank. In the present invention, the traditional dipping of soldering flux is replaced by dipping of tin inhibitor, first dipping tin resist and then tin dipping, so that liquid tin will not quickly climb up the wire, and the length of tin dipping is easy to control.
Description
technical field [0001] The invention relates to the technical field of tin dipping, in particular to a tin dipping process for connecting wires. Background technique [0002] The structure of the connecting wires used on electronic equipment is to protect the sheath and the core wire from the outside to the inside. In order to ensure the welding quality between the connecting wire and the electronic components and meet a certain high-frequency performance, the end of the connecting wire is often dipped Tin, in the traditional tin dipping process, the flux is usually dipped first, and then the tin is dipped, but when this method is dipped in tin, the liquid tin will quickly climb up the wire, and the climbing length is longer, which is not necessary. It is easy to control; for this reason, we propose a connecting wire dipping tin process to solve the above problems. Contents of the invention [0003] The present invention provides a soldering process for connecting wires, ...
Claims
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IPC IPC(8): B23K1/20B23K3/06
CPCB23K1/20B23K1/203B23K3/0669
Inventor 杨国梁程卫亚
Owner SUZHOU LIFA ELECTRONICS