Flat heat pipe with gradient wetting structure

Abstract

The invention discloses a flat heat pipe with a gradient wetting structure. The flat heat pipe comprises a bottom plate, a top plate and supporting plates located between the bottom plate and the topplate. The bottom plate, the top plate and the supporting plates on both sides are connected to form a sealed cavity. A micron-grade radial strip is machined on the inner surface of the bottom plate,and the wetting gradient which is evenly changed from the circle center to the circumference is presented. Super-hydrophilic super-hydrophobic radial structures arranged at intervals are machined on the inner surface of the top plate and used for transporting condensate to the surrounding pipe wall direction. Liquid absorbing cores are arranged on the inner sides of the supporting plates. Since micro-nano machining is carried out on the evaporation surface, the functions of transporting liquid directionally without pump and concentrating the reflux condensate are achieved. Patterning super-hydrophilic super-hydrophobic machining is carried out on the condensation surface, condensate is driven to migrate to the surrounding pipe wall direction, the condensate backflow speed is increased, liquid absorption core structures on the upper and lower surfaces are omitted, heat resistance is reduced, the evaporation and condensation speed is improved, heat exchange performance of an evaporationarea and a condensation area is improved, and therefore the heat exchange performance of a whole flat heat pipe is improved.

Description

technical field [0001] The invention belongs to the technical field of cooling devices for electronic components, and relates to a flat heat pipe with a gradient wetting structure. Background technique [0002] With the rapid development of electronic technology, electronic components are gradually developing toward miniaturization, high speed and high frequency, and high integration. The functions are becoming more and more complex, and the heat flux density of heat dissipation is getting higher and higher, resulting in an increase in the failure rate of electronic equipment. Therefore, realizing efficient heat dissipation of electronic components and ensuring the reliability of electronic components is a current technical difficulty and research hotspot. [0003] The flat plate heat pipe is a high-efficiency phase change heat transfer equipment improved on the basis of the traditional heat pipe. It has the advantages of simple structure, good temperature uniformity and hig...

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Problems solved by technology

[0004] However, the existing flat heat pipe mainly relies on the capillary force provided by the liquid-absorbing core to push the working fluid backflow, and because the evaporation surface and the condensation surface are covered with liquid-absorbing cores, the thermal resistance of t

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