Method for forming conductive structure
A conductive structure and groove technology, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve problems such as incomplete filling, easy formation of impurities or defects, and influence on the uniformity of conductive material growth. performance effect
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[0024] The present invention will be further described below in conjunction with the drawings and embodiments.
[0025] In a preferred embodiment, such as figure 1 As shown, a method for forming a conductive structure is proposed, and the formed structure can be as Figure 2~3 As shown, which can include:
[0026] Step S1, providing a wafer including a substrate 10 on which a trench TR is formed;
[0027] Step S2, pretreating the trench TR with a reducing gas;
[0028] Step S3, using a gas treatment process to remove the reducing gas in the trench TR;
[0029] Step S4, using a deposition process to deposit a polysilicon layer 20 for filling the trench TR in the trench TR to form a conductive structure.
[0030] In the above technical solution, the formed conductive structure may be a contact hole structure that electrically connects the top and bottom; other conventional structures for forming conductive structures may also be formed in the substrate 10 and in the trench TR, such as in t...
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