Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of epoxy adhesive for flexible circuit board and its preparation method and application

A technology for epoxy adhesives and flexible circuit boards, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of unstable bonding performance and short storage time, and achieve lower curing temperature, stable performance, Effect of improving heat aging resistance

Active Publication Date: 2021-04-27
HARBIN INST OF TECH WUXI RES INST OF NEW MATERIALS +1
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the development prospects of epoxy adhesives are constantly optimistic, there are still problems in the application process such as unstable bonding performance and short storage time.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of epoxy adhesive for flexible circuit board and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Weigh 80 parts of E-20 epoxy resin, 20 parts of modified E-51 epoxy resin and 15 parts of carboxyl-terminated liquid nitrile rubber, put them in an oven at 120°C for 4 hours, add 5 parts of methyl ethyl ketone and 5 parts of N,N-dimethylformamide, stirred while hot until completely dissolved, to obtain epoxy resin mixture, placed at room temperature, and then mixed 3 parts of particle size with 5 parts of butanone and 5 parts of N,N-dimethylformamide Dicyandiamide latent curing agent with a diameter of 5 μm and 15 parts of 4,4'-diaminodiphenylsulfone high-temperature curing agent are completely dissolved and then added to the epoxy resin mixture, continue to stir and mix for 30 minutes, and then grind repeatedly with a three-roll mill 3 times to ensure that the latent curing agent is evenly dispersed, and finally add 1 part of 2-ethyl 4-methylimidazole accelerator, 2 parts of 2,4-toluene bis-dimethyl polyurea accelerator, 1 part of BYK- 4511 adhesion promoter, 5 parts o...

Embodiment 2

[0028] Weigh 75 parts of E-20 epoxy resin, 25 parts of modified E-51 epoxy resin and 10 parts of carboxyl-terminated liquid nitrile rubber, put them in an oven at 120°C for 3 hours, add 6 parts of methyl ethyl ketone and 4 parts of N,N-dimethylformamide, stirred while hot until completely dissolved to obtain an epoxy resin mixture, put it at room temperature, and then mixed 5 parts of particle size with 6 parts of methyl ethyl ketone and 4 parts of Dicyandiamide latent curing agent with a diameter of 15 μm and 5 parts of 4,4'-diaminodiphenylsulfone high-temperature curing agent are completely dissolved and then added to the epoxy resin mixture, continue to stir and mix for 30 minutes, and then grind repeatedly with a three-roll mill 3 times to ensure that the latent curing agent is evenly dispersed, and finally add 2 parts of 2-ethyl 4-methylimidazole accelerator, 2 parts of German BYK-4511 adhesion promoter, 6 parts of methyl ethyl ketone and 4 parts of N,N -Dimethylformamide...

Embodiment 3

[0030] Weigh 90 parts of E-20 epoxy resin, 10 parts of modified E-51 epoxy resin and 15 parts of carboxyl-terminated liquid nitrile rubber, put them in an oven at 120°C for 3 hours, add 8 parts of methyl ethyl ketone and 2 parts of N,N-dimethylformamide, stirred while hot until completely dissolved to obtain an epoxy resin mixture, put it at room temperature, and then mixed 1 part of particle size with 8 parts of butanone and 2 parts of N,N-dimethylformamide Dicyandiamide latent curing agent with a diameter of 50 μm and 30 parts of 4,4'-diaminodiphenylsulfone high-temperature curing agent are completely dissolved and then added to the epoxy resin mixture, continue to stir and mix for 30 minutes, and then grind repeatedly with a three-roll mill 3 times to ensure that the latent curing agent is evenly dispersed, and finally add 5 parts of 2-ethyl 4-methylimidazole accelerator, 2 parts of BYK-4511 adhesion promoter, 8 parts of methyl ethyl ketone and 2 parts of N,N -Dimethylforma...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses an epoxy adhesive for flexible circuit boards, a preparation method and application thereof. The epoxy adhesive of the present invention comprises by weight: 85-115 parts of composite epoxy resin; 10-20 parts of toughening agent; 30 parts of solvent; 10-31 parts of composite curing agent; 2-5 parts of composite accelerator; 1-2 parts of focus accelerator. The invention adopts composite epoxy resin, composite curing agent and composite accelerator to overcome the performance deficiency of pure single components, thereby obtaining an adhesive with excellent bonding performance and impact resistance, good heat resistance, and long-term storage.

Description

technical field [0001] The invention belongs to the field of adhesives, and in particular relates to an epoxy adhesive for flexible circuit boards and a preparation method and application thereof. Background technique [0002] In recent years, flexible printed circuit boards (abbreviated as FPC) have always been favored by various electronic products due to their light weight, thin thickness, small size, and flexibility. As one of the main components of FPC, the adhesive will directly affect its performance. Generally speaking, epoxy resin adhesives are widely used in electronic appliances due to their good adhesion, heat resistance, impact resistance, corrosion resistance, etc. Although the development prospects of epoxy adhesives are constantly optimistic, there are still problems in the application process such as unstable bonding performance and short storage time. Contents of the invention [0003] In order to solve the problems in the prior art, the present inventi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J151/06C09J11/08
CPCC08L2205/025C08L2205/035C09J11/08C09J163/00C08L63/00C08L51/06C08L13/00
Inventor 李卫东邓超白永平李晶波殷晓芬
Owner HARBIN INST OF TECH WUXI RES INST OF NEW MATERIALS