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Ultrasonic transducer and manufacturing method thereof

A technology for ultrasonic transducers and manufacturing methods, which is applied in the direction of sound-generating devices, ultrasonic/sonic/infrasonic diagnosis, instruments, etc., and can solve the problem of increasing the number of external leads and the difficulty of wiring, and the emission and reception of ultrasonic transducer array elements Inconvenient control and other problems, to achieve the effect of simple lead wire and easy independent control

Inactive Publication Date: 2019-04-02
SHENZHEN GOODIX TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, this method needs to connect the upper electrode and the integrated circuit on the wafer through external leads. When the number of upper electrodes is large, the number of leads will increase accordingly; thus increasing the number of external leads and the difficulty of wiring.
When the number of external leads is large, it will also cause inconvenience to the transmission and reception control of the ultrasonic transducer array element

Method used

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  • Ultrasonic transducer and manufacturing method thereof
  • Ultrasonic transducer and manufacturing method thereof
  • Ultrasonic transducer and manufacturing method thereof

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Embodiment Construction

[0071] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0072] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the present invention and the above drawings are used to distinguish similar objects, and not necessarily Used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate ci...

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Abstract

The invention provides an ultrasonic transducer and a manufacturing method thereof. The ultrasonic transducer comprises a substrate (106), a lower electrode (105), a support block (103), a diaphragm layer (102), and an upper electrode (101) arranged sequentially in a stacked manner, wherein a groove is arranged on a surface of the substrate near the diaphragm layer, and the lower electrode is filled in the groove, the support block (103) separates the space between the diaphragm layer (102) and the substrate (106) into a closed cavity (104), and the cavity (104) corresponds to the position ofthe lower electrode (105). Therefore, arraying of the low electrode is realized, the lead mode is simpler, and the transmission and reception of ultrasonic transducer array elements are conveniently controlled independently.

Description

technical field [0001] The present application relates to the technical field of ultrasonic imaging, in particular to an ultrasonic transducer and a manufacturing method thereof. Background technique [0002] With the development of biometric technology, more and more terminals are equipped with biometric chips. The capacitive micromachined urtrosonic transducer (CMUT) is a relatively common biometric sensor, which actively transmits high-frequency sound waves through the screen to reach the surface of the organism, and then collects the echoes of the ultrasonic waves in the pressed area to form a biometric sensor. Skin feature image, and finally compare the skin feature image with the stored image to complete functions such as fingerprint recognition and liveness detection. [0003] The current ultrasonic transducer usually includes a flexible substrate, a lower electrode, an etching sacrificial layer, an organic polymer support layer, an organic polymer vibrating film, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B8/00G06K9/00G10K9/122G10K11/02
CPCG10K9/122G10K11/02A61B8/4483G06V40/1306
Inventor 王红超沈健李运宁
Owner SHENZHEN GOODIX TECH CO LTD
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