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A stamping process for products with a gap width-thickness ratio less than 1

A width-to-thickness ratio and gap technology, which is applied in the stamping process of products, can solve the problems of high cost and low production efficiency, and achieve the effect of improving hardness, improving efficiency and exempting maintenance

Inactive Publication Date: 2020-07-28
翔龙泰达实业(海南)有限公司
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  • Summary
  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The embodiment of the present invention provides a stamping process for products with a gap width-thickness ratio less than 1, so as to solve the problems of low production efficiency and high cost in the existing processing methods for products with gap width-thickness ratios less than 1

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  • A stamping process for products with a gap width-thickness ratio less than 1
  • A stamping process for products with a gap width-thickness ratio less than 1
  • A stamping process for products with a gap width-thickness ratio less than 1

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Embodiment Construction

[0021] The technical solutions in this embodiment of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in this embodiment of the present invention. Obviously, the described embodiment is an embodiment of the present invention, not all of the present invention. implementation. Based on this implementation manner in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts fall within the protection scope of the present invention.

[0022] see figure 1 , which is a schematic diagram of the comparison between the gap width and the product thickness of the product of the present invention. As shown in the figure, the present invention provides a stamping process, which is used to manufacture products with a gap width-thickness ratio of less than 1, the ratio of the width t1 of the gap 11 of the product to the thickness t2 of the product i...

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Abstract

The invention discloses a stamping process of a product with the less than 1 gap width ratio. The stamping process of a product with the less than 1 gap width ratio is used for forming a gap in the product, and the ratio of the width of the gap and the thickness of the product is less than 1. The stamping process comprises the steps that a material part is stamped through a stamping mould, a V-shaped opening is formed in the material part, the opposite sides of the stamped material part are extruded through a side pushing mould, and the width of the V-shaped opening is narrowed to form the product with the gap. According to the stamping process of the product with the less than 1 gap width ratio, producing the product with the less than 1 gap width ratio through a stamping mode is realized, the size of a stamping needle is not limited by the size of the gap, the stamping needle is enabled to be bigger and provided with higher hardness, frequent damage of the stamping needle is avoided,then the frequency of equipment maintenance is reduced, and the product yield is improved.

Description

technical field [0001] The invention relates to the field of punching technology, in particular to a punching technology for products with a gap width-thickness ratio less than 1. Background technique [0002] In the existing industrial production, it is very difficult to process thicker metal materials and form products with small gaps, especially for products that require the width of the gap to be smaller than the thickness of the material, generally only wire cutting, electric Sparks and other processing methods are used for processing, but the principle of this processing method is to corrode the product through electric discharge, and then shape the product, such as creating gaps, through holes, etc., the production efficiency is low, the manufacturing cost is high, and the products produced are competitive after being put into the market The power is low, and the negative impact on the environment is large, which is not conducive to the development of production. [...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21D35/00B21D37/10
CPCB21D35/002B21D37/10
Inventor 余小波陈东海余翔余泰龙陈裕康陈乐盈梁丽虹
Owner 翔龙泰达实业(海南)有限公司