Wiring method for reinforcing protection on important region of metal protection layer at top layer of chip
A top-layer metal and important area technology, applied in the field of chip technology, can solve problems such as simple connection relationship, failure of the protective layer, single step-down form, etc., and achieve the effect of increasing the safety factor, increasing the difficulty, and improving the protection level
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[0020] The present invention has carried out focused evolution and modification for the traditional configuration method of the top metal layer wiring, and can focus on the protection of modules that are easy to leak data on the chip, such as memory modules and data buses.
[0021] 1. The wiring configuration method of the top protective layer:
[0022] According to the protection area and degree of protection required by the chip module, the entire wiring layer is divided into multiple wiring areas. figure 1 It is a schematic diagram of the internal layout of a chip. The wiring area is divided into several types according to the security level of the internal structure of the chip, and the number of wiring lines is positively correlated with the security level of the area. Each routing area can be filled with serpentine routing, parallel routing, and random Hamiltonian loops. Among them, the random Hamiltonian circuit image has a high degree of disorder. It can reduce the ...
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