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Instant transfer chip

A technology for transferring chips and notches, which is applied in the field of instant transfer, can solve the problems of inability to prevent wear on the outer wall surface, impact on service life, inability to transfer and release heat, etc., and achieve the goals of improving flexibility, prolonging service life, and shortening service life Effect

Inactive Publication Date: 2019-04-09
林明镜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a kind of instant transfer chip, to solve the existing chip that can be used for instant transfer proposed in the above-mentioned background technology, because it cannot carry out anti-wear protection to its outer wall surface, and because it cannot work The heat generated during the process is quickly transferred and released, which affects its service life.

Method used

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] see Figure 1-3 , the present invention provides a technical solution: an instant transfer chip, including a housing 1, a bottom plate 3 and a first notch 4, an upper plate 2 is arranged inside the housing 1, and an anti-wear block is included inside the upper plate 2 201 and rubber block 202, the top surface of the upper plate 2 is provided with an anti-wear block 201, and a rubber block 202 is arranged between the anti-wear blocks 201, the connection ...

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Abstract

The invention discloses an instant transfer chip, comprising a shell, a bottom plate and a first recess, wherein an upper plate is arranged in the shell, the bottom plate is arranged at a bottom end of the upper plate, the bottom plate and the upper plate are in screw connection, and the first recess is arranged in the bottom end of the upper plate. According to the instant transfer chip disclosedby the invention, a unique time calculator is paused or damaged to let the time calculator to perform self-repair, a timetable of a certain part is overloaded by using high-voltage current, so that the self-repair process starts moving instantly, when the chip encounters substance with strong magnetism, the function of breaking the time calculator can be achieved, a person and the substance can go to any expected place under the guide of electromagnetic wave, the chip can be applied to a series of electronic products such as mobile phones, computers, smart watches and the like, and the personcan mark the place where himself wants to go on a world map and regional maps of the mobile phone just like turn on a flashlight, and then check the destination and click once to perform space shuttle.

Description

technical field [0001] The invention relates to the technical field of instant transfer, in particular to an instant transfer chip. Background technique [0002] Teleportation is a kind of extrasensory perception in the field of parapsychology, which refers to the phenomenon and ability of transporting objects to different spaces, or moving oneself to other places in an instant; teleportation often appears in science fiction works. One category of works often set this ability as a state of discontinuous space jump, which is a different phenomenon from extremely high-speed movement; in terms of current science, only quantum teleportation technology can achieve instantaneous transmission of quantum state information To different locations; thus, the design of chips that can be transferred instantly plays a role in promoting the development of scientific research technology. [0003] The existing chips that can be used for instant transfer have an impact on their service life ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/04H01L23/06H01L23/367
CPCH01L23/04H01L23/06H01L23/367
Inventor 林明镜
Owner 林明镜