12-micron copper foil full-automatic arranging system

Abstract

The invention discloses a 12-micron copper foil full-automatic arranging system. The system comprises a steel plate conveyor, wherein a dust sticking machine is arranged below the steel plate conveyor; a first lower copper foil conveying and transferring machine is arranged below the dust sticking machine; a third lower copper foil conveying and transferring machine, a second lower copper foil conveying and transferring machine and a lower copper foil cutting machine are sequentially connected below the first lower copper foil conveying and transferring machine; an upper copper foil cutting machine is arranged on the right side of the lower copper foil cutting machine; a first upper copper foil conveyor is arranged above the upper copper foil cutting machine; a second upper copper foil conveyor is arranged above the first upper copper foil conveyor; a combined table is arranged on the right side of the second upper copper foil conveyor; a double-layer conveyor is arranged at the top ofthe combined table; and a sandwich material clamping and transferring machine is arranged between the first lower copper foil conveying and transferring machine and the combined table. The system hasthe advantages of being reasonable in structure, stable in performance and easy to operate, and is convenient and rapid to maintain; and meanwhile, the copper wrinkle rate of the copper foil is greatly lowered.

Description

technical field [0001] The invention relates to the technical field of electronic production, in particular to a 12um copper foil automatic typesetting system. Background technique [0002] At present, electronic products have higher and higher requirements for circuit boards, which makes circuit boards gradually tend to be thinner, smaller and lighter; however, the traditional layout and lamination system has almost no copper wrinkles when making 18um and 35um thick copper foils, but when making 12um thick The copper foil will produce a copper wrinkle rate of more than 5 / 1000, which will cause a large amount of scrapping of the laminated boards, resulting in customer losses; obviously the traditional typesetting method has been unable to meet the customer's technical requirements for copper foil, not only can not be realized The factory automates the production process of 12um thick copper foil, and does not have a production system with reasonable structure, stable perform...

AI Technical Summary

Problems solved by technology

[0002] At present, electronic products have higher and higher requirements for circuit boards, which makes circuit boards gradually tend to be thinner, smaller and lighter; however, the traditional layout and lamination system has almost no copper wrinkles when making 18um and 35um thick copper foils, but when making 12um thick The copper foil will produce a copper wrinkle rate of more than 5 / 1000, which will cause a large amount of scrapping of the laminated boards, resulting in customer losses; obviously the traditional typesetting method has been unable to meet the customer's technical requirements for copper foil, not only can not be realized The factory automates the production process of 12um thick copper foil, and does not have a production system with reasonable structure, stable performance, simple operation, and convenient maintenance

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