12-micron copper foil full-automatic arranging system
A fully automatic, copper foil technology, applied in electrical components, manufacturing of printed circuit precursors, printed circuit manufacturing, etc., can solve the problems of inability to realize automation of 12um thick copper foil, lack of reasonable structure, customer loss, etc. The effect of automation, convenient and fast maintenance, and labor cost reduction
Inactive Publication Date: 2019-04-12
永天机械设备制造(深圳)有限公司
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Problems solved by technology
[0002] At present, electronic products have higher and higher requirements for circuit boards, which makes circuit boards gradually tend to be thinner, smaller and lighter; however, the traditional layout and lamination system has almost no copper wrinkles when making 18um and 35um thick copper foils, but when making 12um thick The copper foil will produce a copper wrinkle rate of more than 5 / 1000, which will cause a large amount of scrapping of the laminated boards, resulting in customer losses; obviously the traditional typesetting method has been unable to meet the customer's technical requirements for copper foil, not only can not be realized The factory automates the production process of 12um thick copper foil, and does not have a production system with reasonable structure, stable performance, simple operation, and convenient maintenance
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[0034] The specific implementation is as follows:
[0035] This equipment is connected to the PCB multi-layer board production line. First, the steel plate conveyor 11 conveys the steel plate through the dust sticking machine 12 to remove dust and transport it to the first lower copper foil conveying and transferring machine 21 to stop at the designated position, and then the lower copper foil is cut. Machine 22 cuts a piece of copper foil and transports it to the second lower copper foil conveying and transferring machine 24, and then the third lower copper foil conveying and transferring machine 25 sucks the copper foil from the second lower copper foil conveying and transferring machine 24 Place it on the first lower copper foil conveying and transferring machine 21. At this time, a steel plate and copper foil are combined into a sandwich shape, and then the sandwich-shaped copper foil and steel plate are picked up by the suction head of the sandwich clamping and transferrin...
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The invention discloses a 12-micron copper foil full-automatic arranging system. The system comprises a steel plate conveyor, wherein a dust sticking machine is arranged below the steel plate conveyor; a first lower copper foil conveying and transferring machine is arranged below the dust sticking machine; a third lower copper foil conveying and transferring machine, a second lower copper foil conveying and transferring machine and a lower copper foil cutting machine are sequentially connected below the first lower copper foil conveying and transferring machine; an upper copper foil cutting machine is arranged on the right side of the lower copper foil cutting machine; a first upper copper foil conveyor is arranged above the upper copper foil cutting machine; a second upper copper foil conveyor is arranged above the first upper copper foil conveyor; a combined table is arranged on the right side of the second upper copper foil conveyor; a double-layer conveyor is arranged at the top ofthe combined table; and a sandwich material clamping and transferring machine is arranged between the first lower copper foil conveying and transferring machine and the combined table. The system hasthe advantages of being reasonable in structure, stable in performance and easy to operate, and is convenient and rapid to maintain; and meanwhile, the copper wrinkle rate of the copper foil is greatly lowered.
Description
technical field [0001] The invention relates to the technical field of electronic production, in particular to a 12um copper foil automatic typesetting system. Background technique [0002] At present, electronic products have higher and higher requirements for circuit boards, which makes circuit boards gradually tend to be thinner, smaller and lighter; however, the traditional layout and lamination system has almost no copper wrinkles when making 18um and 35um thick copper foils, but when making 12um thick The copper foil will produce a copper wrinkle rate of more than 5 / 1000, which will cause a large amount of scrapping of the laminated boards, resulting in customer losses; obviously the traditional typesetting method has been unable to meet the customer's technical requirements for copper foil, not only can not be realized The factory automates the production process of 12um thick copper foil, and does not have a production system with reasonable structure, stable perform...
Claims
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IPC IPC(8): H05K3/02
CPCH05K3/022
Inventor 张家豪
Owner 永天机械设备制造(深圳)有限公司