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A computer cpu cooling device

A heat dissipation device and computer technology, applied in the field of computers, can solve the problems of poor heat dissipation, space occupation, and difficult maintenance, etc., and achieve the effects of improved heat dissipation, easy maintenance, and increased contact area

Active Publication Date: 2022-05-17
汉中市中心医院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a computer CPU cooling device in order to solve the problems of poor cooling effect, space occupation, and difficult maintenance.

Method used

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  • A computer cpu cooling device
  • A computer cpu cooling device
  • A computer cpu cooling device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment one, with reference to figure 1 and 2 , a computer CPU cooling device, comprising a fixed base 1, the top center of the fixed base 1 is welded with a fixed frame 2, the fixed base 1 and the fixed frame 2 are made of good heat dissipation and heat-conducting materials, and the fixed frame 2 is embedded with a CPU9 , in order to fix the CPU9 through the fixed frame 2, the top of the fixed base 1 is located on both sides of the vertical center line, and two vertical bars 5 are arranged through it, and the bottom center of the fixed base 1 is provided with a fixed plate 4, and the fixed plate 4 is connected with the two by screws. Two vertical rods 5 are threaded, and the other ends of the two vertical rods 5 are welded with a heat dissipation cover 6. The heat dissipation cover 6 has a double-layer structure, so that the interior of the heat dissipation cover 6 is hollow, so as to realize heat dissipation for the circulation of objects. The top of the heat dissi...

Embodiment 2

[0025] Embodiment two, refer to Figure 2-4 , the center of the bottom of the cooling cover 6 is welded with a semiconductor cooling chip 3, and the low temperature end of the semiconductor cooling chip 3 is welded with the cooling cover 6, and the high temperature end is bonded to the CPU9. A temperature difference is formed on the surface of the cover 6. Using this temperature difference phenomenon, an excellent heat dissipation effect is achieved. A compressor plate 12 is slidably embedded in the box body 11. The compressor plate 12 is vertically provided with two slide bars 15, and two Both ends of the slide bar 15 are welded with the inner wall of the box body 11, and the positioning of the compressor plate 12 is realized by the two slide bars 15. The bottom of the inner wall of the box body 11 is welded with two limit tubes 17, two limit tubes The top center of 17 is provided with a pressure rod 19 through, and the pressure rod 19 is positioned at two round blocks 18 in ...

Embodiment 3

[0026] Embodiment three, refer to figure 2 and 5 , the outer wall of the box body 11 is uniformly provided with through holes, through which the box body 11 can be ventilated with the outside world, the cooling net 8 is formed by the horizontal tube 81 and the vertical tube 82, and the horizontal tube 81 is connected with the vertical tube 82, and the horizontal tube 81 is connected to the vertical tube 82 Pipe 81 and standpipe 82 form a reticular structure, can increase the contact area with air by radiating net 8, be provided with the liquid of low temperature pollution-free in radiating cover 6, CPU9 can transfer heat on radiating cover 6, the liquid that is heated will The gas is formed to enhance the heat dissipation effect of the heat dissipation scales 7, and the hot gas will enter the heat dissipation net 8 and be cooled in the horizontal pipe 81 and the vertical pipe 82 to form a liquid, which will flow into the bottom along the inner wall of the heat dissipation cov...

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Abstract

The invention discloses a computer CPU cooling device, comprising a fixed base, a fixed frame is welded at the center of the top of the fixed base, a CPU is embedded in the fixed frame, so that the CPU can be fixed through the fixed frame, and the top of the fixed base is located at two sides of the vertical center line. The side penetration is provided with two vertical bars. In the present invention, a low-temperature and harmless heat-absorbing liquid can be placed in the heat dissipation cover. The liquid will be heated to form a gas and enter the heat dissipation net. When the gas is cooled, it will become a liquid and flow into the bottom along the inner wall of the heat dissipation cover to realize circulation. Heat dissipation, because the heat dissipation net is a mesh structure, which can increase the contact area with the air, thereby enhancing the heat dissipation effect. Through the intermittent power-on and power-off of the second spring, the iron block reciprocates to adsorb the magnetic iron and can be squeezed The air is blown to the heat dissipation net, so that the heat dissipation effect of the heat dissipation net is improved, and the air circulation in the heat dissipation cover can also be driven, and the CPU can be replaced by dismantling by twisting the screw.

Description

technical field [0001] The invention belongs to the technical field of computers, in particular to a computer CPU cooling device. Background technique [0002] The computer CPU is the core component of the computer and is a high-speed processor. When the computer is running, the CPU will generate a lot of heat. If the heat cannot be dissipated in time, there will be accumulation phenomenon, which will cause the computer to freeze, crash, and seriously cause the CPU to burn out. It is necessary to use a cooling device to dissipate heat from the CPU. . [0003] The existing computer CPU cooling device generally uses a fan to blow air to the CPU, and adopts a single air flow to carry out heat dissipation processing. The heat dissipation is unstable and takes up a large space. It is solid and in a static state. It can only dissipate heat through the contact area with the air. The heat dissipation speed is slow and the heat dissipation effect is poor. At the same time, it is ve...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 张凌杰
Owner 汉中市中心医院
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