A multi-memory-grain storage device and an identification method

Abstract

The invention relates to a multi-storage-grain storage device and an identification method thereof. The method is applied to embedded equipment with a multi-storage-crystal-grain storage device. The embedded device is provided with a processing unit and a synchronous dynamic random access memory. The method comprises the following steps: 1, setting a memory time sequence comparison table and a dynamic random access memory model mapping comparison table, storing the table in a synchronous dynamic random access memory; enabling the processing unit to confirm the number of the universal input / output pins of the multi-storage crystal grain storage device; After the initial general input / output pin level is preloaded through the processing unit, obtaining the model of the dynamic random accessmemory according to the combined level information, obtaining the memory time sequence number of the dynamic random access memory, and initializing the dynamic random access memory according to the memory time sequence number to complete identification.

Description

technical field [0001] The invention relates to the technical field of embedded equipment, in particular to a storage device with multiple storage grains and an identification method. Background technique [0002] Mobile devices such as mobile phones and tablet computers are becoming more and more thin and even compact, which has become a difficult problem for manufacturers to construct. In order to save space, putting multiple chips into a single structure has become the focus of each manufacturer's efforts. Random Access Memory (Random Access Memory) , RAM) and read-only memory (Read-OnlyMemory, ROM) integration and packaging has also become one of them. With the development of technology, random access memory and ROM can be integrated into one, and even a control chip can be directly built in, which saves cost or production troubles for mobile phone manufacturers. [0003] After in-depth research on existing technologies, in the past two years, due to the high demand in ...

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Problems solved by technology

[0003] After in-depth research on existing technologies, in the past two years, due to the high demand in the smartphone market and the impact of the average unit price of mobile memory, the price of embedded multi-chip packaging (eMCP) has also been rising steadily. Dynamic random access memory (Discrete DRAM) plus discrete flash memory (Discrete Flash) replaces embedded multi-chip package (eMCP), which can save costs to a large extent, but because most domestic suppliers will use the same Fab die (DIE), followed by dynamic random access memory (DRAM) compatibility issues, reduced code maintainability, and increased development difficulty

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