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Photosensitive adhesive composition

一种粘接剂、组合物的技术，应用在胶粘剂、改性环氧树脂粘合剂、粘合剂加热的粘合方法等方向，能够解决不能使用等问题，达到优异耐溶剂性、透湿防止性优异的效果

Active Publication Date: 2019-04-16
NISSAN CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat resistance of PET resin, PEN resin, and PC resin known as resin materials used in known plastic substrates is only about 250°C. In the past, there was a requirement of 250°C or higher for the thin film transistor (TFT) formation process. The problem that it cannot be used in high temperature process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0071] Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited by these examples.

[0072] The following apparatus was used for the GPC analysis of the polymer obtained in the synthesis example described below, and the measurement conditions are as follows.

[0073] Device: Integrated high-speed GPC system HLC-8220GPC manufactured by Tosoh Corporation

[0074] Column: KF-G, KF804L

[0075] Column temperature: 40°C

[0076] Solvent: Tetrahydrofuran (THF)

[0077] Flow: 1.0mL / min

[0078] Standard sample: polystyrene

[0079] Detector: RI

[0080]

[0081] Dissolve 127.99 g of 1,2-cyclohexanedicarboxylic acid, 175.00 g of monoallyl diglycidyl isocyanuric acid, and 7.20 g of benzyltriethylammonium chloride in propylene glycol 1-monomethyl ether 2- After 465.28 g of acetate, it was made to react at 140 degreeC for 4 hours, and the solution containing a polymer was obtained. After cooling the obtained ...

Embodiment 2

[0098] 3.5 g of the polymer-containing solution obtained in Preparation Example 1, 17.30 g of the polymer-containing solution obtained in Preparation Example 2, 0.023 g of IRGACURE [registered trademark] OXE01 (manufactured by BASF Corporation), tricyclodecane dimethanol dimethanol Dissolve 0.34 g of acrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) and 0.056 g of pentaerythritol tetrakis(3-mercaptobutyrate) (manufactured by Showa Denko Co., Ltd.) in propylene glycol 1-monomethyl ether 2-acetate 8.28g to prepare a composition. Then, this was filtered using a polyethylene microfilter with a pore diameter of 3 μm to prepare a photosensitive adhesive composition. The mass ratio of the polymer solids in Preparation Example 1 and Preparation Example 2 was 1:5.

Embodiment 3

[0100] 2.0 g of the polymer-containing solution obtained in Preparation Example 1, 13.35 g of the polymer-containing solution obtained in Preparation Example 2, 0.014 g of IRGACURE [registered trademark] OXE01 (manufactured by BASF Corporation), tricyclodecane dimethanol dimethanol Dissolve 0.21 g of acrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) and 0.035 g of pentaerythritol tetrakis(3-mercaptobutyrate) (manufactured by Showa Denko Co., Ltd.) in propylene glycol 1-monomethyl ether 2-acetate 5.08g to prepare a composition. Then, this was filtered using a polyethylene microfilter with a pore diameter of 3 μm to prepare a photosensitive adhesive composition. The mass ratio of the polymer solids in Preparation Example 1 and Preparation Example 2 was 1:6.

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Abstract

The theme of the invention is to provide a novel photosensitive adhesive composition. A photosensitive adhesive composition comprises components (A), (B), (C), and (D), the component (B) being contained in a higher mass proportion than the component (A). Component (A) is a polymer which has a structural unit represented by formula (1) and has, at a terminal, a structure represented by formula (2);component (B) is a polymer which has a structural unit represented by the formula (1) and has the carboxy or hydroxy group at a terminal; component (C) is a free-radical photopolymerization initiator; and component (D) is a solvent. (In the formulae, X represents a C1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group; m and n are each independently 0 or 1; Q represents a C1-16 divalent hydrocarbon group; Z represents a C1-4 divalent linking group, the divalent linking group being bonded to the -O- moiety of the formula (1); and R1 represents a hydrogen atom or a methyl group).

Description

technical field [0001] The present invention relates to a photosensitive adhesive composition comprising a polymer into which a site capable of radical crosslinking has been introduced. Background technique [0002] In recent years, as electronic devices such as mobile phones and IC cards have become more functional and miniaturized, higher integration of semiconductor devices has been demanded. As a method for this, miniaturization of the semiconductor element itself and a stacked structure in which semiconductor elements are stacked vertically have been studied. In fabrication of a build-up structure, an adhesive is used for bonding between semiconductor elements. However, acrylic resins, epoxy resins, and silicone resins known as well-known adhesives have heat resistance of only about 250°C, and there are cases where high temperatures of 250°C or higher are required for electrode bonding of metal bumps and ion diffusion processes. Such problems cannot be used in the pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J167/00C08F290/06C08F299/02C08G75/045C09J11/06C09J167/07C09J171/08G03F7/004G03F7/027
CPCC08F290/06C08F290/061C08F290/064C08G59/26C08G59/3236C08G73/0622C08G73/0638C08G73/0655C09J163/00C09J163/06C09J163/10C08F299/02C08G75/045C09J11/06C09J167/00C09J167/07C09J171/08G03F7/004G03F7/027C09J5/06G03F7/20G03F7/26G03F7/40C08G73/0644C08G85/004C08K5/101C08K5/14C09J9/00C09J179/04C09J2301/416G03F7/09
Inventor 大桥拓矢榎本智之岸冈高广
Owner NISSAN CHEM CORP
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