Wafer loading-unloading device

Abstract

The invention relates to the technical field of semiconductors, and particularly relates to a wafer loading-unloading device. The wafer loading-unloading device comprises a wafer loading table, a location compensation mechanism, a first drive mechanism, a second drive mechanism, a first adjustment mechanism and a second adjustment mechanism, wherein the wafer loading table is arranged on the location compensation mechanism; the first drive mechanism is arranged above the second drive mechanism; the second drive mechanism is capable of driving the location compensation mechanism to move towardsone end close to or away from a retaining ring; the first drive mechanism is connected with the wafer loading table; the first adjustment mechanism and the second adjustment mechanism are arranged between the first drive mechanism and the second drive mechanism; and the first adjustment mechanism and the second adjustment mechanism are used for adjusting the transversal position and the longitudinal position of the first drive mechanism, so that the wafer loading table is capable of accurately unloading a wafer from the interior of the retaining ring or installing the wafer into the retainingring. The technical problem of inevitable position difference due to a movement error or machining accuracy limit in the prior art is solved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer loading and unloading device. Background technique [0002] In the manufacturing process of semiconductor integrated circuit chips, the chemical mechanical polishing process (CMP) has been applied many times throughout the entire integrated circuit manufacturing process. Among them, the wafer loading and unloading mechanism is a key transmission component of chemical mechanical polishing equipment, and it is one of the necessary conditions to have high and reliable transmission accuracy. [0003] In order to meet the high-yield process, the multi-disc and multi-head polishing structure is gradually showing its significance. In the multi-head multi-disk polishing structure, when the wafer loading and unloading mechanisms at different stations are aligned with the corresponding polishing heads, there are inevitably differences in position due to motion errors or pro...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a seed wafer loading and unloading device, to improve existing multi-head multi-disk polishing structure in the prior art, when aligning between the wafer loading and unloading mechanisms of different stations and the corresponding polishing head, due to motion errors Or the technical problem that the difference in position is inevitable due to the limitation of machining accuracy

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