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Photonic integrated circuit

A photonic integrated circuit, transverse electrical technology, applied in the coupling field of optical fiber, can solve the problems of expensive, not allowing sufficient limitation of transverse magnetic component, optical power loss, etc.

Inactive Publication Date: 2019-04-23
仪征市嘉中电子元件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, existing solutions are expensive, as they require implementation of specific fabrication methods, and they do not allow sufficient confinement of the transverse magnetic component, leading to signal diffusion into the carrier substrate of the integrated circuit and consequent loss of optical power

Method used

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  • Photonic integrated circuit
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Examples

Experimental program
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Embodiment Construction

[0043] figure 1 is a cross-sectional view of a photonic integrated circuit according to one embodiment.

[0044]The integrated circuit includes a semiconductor substrate or film 5, which includes various active hardware components 51 and passive hardware components 50, and the semiconductor substrate or film 5 is fabricated on a buried insulating layer 9, which is usually prepared by those skilled in the art. Referred to by the skilled person by the acronym BOX (“buried oxide”), the buried insulating layer 9 itself is produced on a carrier substrate (not shown).

[0045] The semiconductor substrate 5 is covered by an interconnect region 6 (or BEOL, "back end of line" according to an acronym well known to those skilled in the art), which comprises a plurality of metal layers 60, 61, 62, 63.

[0046] Each metal layer comprises one or more metal tracks 601 encapsulated in an insulating material or intermetal dielectric (IMD), here silicon dioxide. The metal tracks are connecte...

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PUM

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Abstract

The invention relates to a photonic integrated circuit. The photonic integrated circuit comprises optical coupling equipment located between every two continuous mutual-connecting metal layers. Each optical coupling equipment comprises a first optical part, a second optical part, a third optical part and a fourth optical part; the first optical parts receive optical signals with transverse magnetic components and transverse electrical components in ground modes; the second optical parts convert the transverse magnetic components of the optical signals to the converted transverse electrical components located in high order modes; the third optical parts separate the transverse electrical components from the converted transverse electrical components and switch the high order modes to the ground modes; and the fourth optical part transmit the transverse electrical components to one of waveguides and transmit the converted transverse electrical components to the other waveguide.

Description

technical field [0001] Implementations and embodiments relate to integrated photonic circuits, in particular to the coupling of input devices such as optical fibers to circuits of this type, and most particularly to the coupling of optical fibers for transmitting signals over long distances. Background technique [0002] Optical fiber-based transceivers allow the transmission of signals over long distances. They often use frequency multiplexing to be able to transmit / receive multiple signals using a single fiber. Therefore, they transmit signals in a wide frequency band. [0003] However, today's coupling devices are often custom-made for a restricted frequency range. [0004] Furthermore, an optical signal traveling in a conventional optical fiber is polarized in a random manner, ie, the orientation of its electric field is random. Furthermore, an optical signal traveling in a conventional waveguide of an integrated circuit (ie, a waveguide of rectangular cross-section) ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/126G02B6/122G02B6/42
CPCG02B6/126G02B6/122G02B6/4213
Inventor 陆远林
Owner 仪征市嘉中电子元件有限公司