Unlock instant, AI-driven research and patent intelligence for your innovation.

Information processing method and device

An information processing method and state information technology, applied in the field of information processing methods and devices

Active Publication Date: 2021-01-19
SHENZHEN H&T DATA RESOURCES & CLOUD TECH LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the solder paste printing machine needs to be manually adjusted and installed based on experience, and the printed steel plate cannot be consistent for every model, so it can only be adjusted according to rough experience

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Information processing method and device
  • Information processing method and device
  • Information processing method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0051] In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings.

[0052] The terms "first", "second" and the like in the description and claims of the present application and the above drawings are used to distinguish different objects, rather than to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally further includes For other steps or units inherent in these processes, methods or apparatuses.

[0053] See figure 1 , figure 1is a schematic flowchart of an information processing method provided in the embodiment of this applicat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an information processing method and device. The information processing method comprises the steps that state information of solder paste in the printing process is obtained; the detection result of a solder paste inspection (SPI) to the solder paste is obtained; the causality between the state information and the detection result is established through a gradient lifting regression model; and the target information is determined according to the causality and used for expressing key state information, affecting the detection result of the solder paste, in the state information. By adopting the information processing method, the reason of poor solder paste quality can be accurately positioned.

Description

technical field [0001] The present application relates to the field of computer technology, in particular to an information processing method and device. Background technique [0002] Solder paste printing and solder paste inspection (SPI) inspection are key production links in electronics manufacturing factories. In addition, the solder paste printing machine is often followed by the SPI testing equipment to evaluate the printing effect and quality in time, find unqualified printed circuit boards (printed circuit board, PCB) in time, and reduce production losses. At the same time, SPI testing equipment can detect information such as the thickness, shape, and offset of solder paste, and provide simple statistical indicators, and can even communicate with solder paste printing equipment for feedback. SPI inspection covers the complete process from pre-printing circuit board information to printing to post-printing. Moreover, the SPI detection equipment can feed back the off...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B41M1/12B41M1/22G01B11/06
CPCB41M1/12B41M1/22G01B11/06
Inventor 张树荣
Owner SHENZHEN H&T DATA RESOURCES & CLOUD TECH LTD