Square silicon wafer compatibility rotating tray and silicon wafer cleaning device

Abstract

The invention relates to the technical field of silicon wafer cleaning for semiconductor wafer processing, and discloses a square silicon wafer compatibility rotating tray and a silicon wafer cleaningdevice. Specifically, the square silicon wafer compatibility rotating tray includes a bottom supporting chuck. At least one silicon wafer supporting mechanism is arranged on the bottom supporting chuck. Each silicon wafer supporting mechanism includes a supporting column group and a retaining column group which are fixed on the bottom supporting chuck. Each supporting column group includes four supporting columns. Each retaining column group includes four retaining column units, and each retaining column unit includes two retaining columns. The contact area between silicon wafers and supporting members is reduced, the surfaces of silicon wafers are protected from scratch and damage to the greatest extent, and the problem that the surface of a silicon wafer is damaged due to large contactarea between a supporting body and the silicon wafer or the problem that the surface of a silicon wafer cannot be cleaned and even there are fragments due to instable supporting in the traditional supporting mode is avoided.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cleaning for semiconductor silicon wafer processing, in particular to a square silicon wafer compatible rotary tray and a silicon wafer cleaning device. Background technique [0002] With the development of the semiconductor industry, the critical dimensions of the device process technology are continuously shrinking, which narrows the process window for cleaning during chip processing. It is difficult for the traditional batch cleaning technology to achieve less surface scratches and structural damage. [0003] The current wet cleaning of silicon wafers can be divided into three methods: multi-slot cleaning, single-slot cleaning and single-wafer cleaning. Compared with the first two methods, single-wafer cleaning can better reduce the crossover caused by the batch processing process Infection, thereby improving the yield. However, for the yield of ultra-thin silicon wafers in the CMP (Chem...

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Problems solved by technology

[0006] The purpose of the present invention is to provide a compatible rotary tray for square silicon wafers, to solve the technical problems existing in the prior art that the fixed carrying method of silicon wafers is easy to accumulate chemical liquid and easily damage the surface of silicon wafers

[0007] The purpose of the present invention is also to provide a silicon wafer cleaning device to solve the technical problems existing in the prior art that the silicon wafer fixing and carrying method is easy to accumulate chemical liquid and easily damage the surface of the silicon wafer

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