A method and apparatus for analyzing a semiconductor wafer

Abstract

The invention provides a method and a device for analyzing a semiconductor wafer. The method and the device are used for analyzing a defect distribution mode on a to-be-detected semiconductor wafer. The method comprises the following steps: acquiring a defect distribution map of the to-be-tested semiconductor wafer, wherein the defect distribution map indicates defect distribution in a plane of the to-be-tested semiconductor wafer; establishing a three-dimensional to-be-tested model according to the defect distribution map, the XY plane of the three-dimensional to-be-tested model correspondingto the plane of the to-be-tested semiconductor wafer, and the Z axis of the three-dimensional to-be-tested model corresponding to the number of defects in each grid unit in the XY plane; and calculating the similarity between the three-dimensional to-be-tested model and at least one three-dimensional reference model to determine the defect distribution mode of the to-be-tested semiconductor wafer, each three-dimensional reference model indicating the defect distribution of one mode. Through the above method, intelligent identification and monitoring early warning can be carried out on specialdistribution defects.

Description

technical field [0001] The invention relates to the field of defect analysis, in particular to the defect analysis and monitoring and early warning of semiconductor wafers. Background technique [0002] Defect monitoring and defect analysis has always been one of the indispensable and important links in the semiconductor process flow. Especially in the production process of large-scale integrated circuit wafers, the defect problem generated during the detection process of each process node is a necessary means to control and improve the yield rate. That is to say, how to accurately screen defective semiconductor wafers from many semiconductor wafers is a prerequisite for ensuring subsequent defect analysis, control and improvement of yield. [0003] At present, the industry mainly relies on defect number threshold alarms for online defect monitoring. With the gradual development of semiconductor manufacturing processes, the absolute number of defects has been better control...

AI Technical Summary

Problems solved by technology

[0008] As mentioned above, in order to solve the problem that the existing technology cannot effectively monitor and analyze various high defects with different quantities and different distributions, the present invention provides a method for analyzing semiconductor wafers, which is used to analyze the semiconductor wafers to be tested. Defect distribution patterns on a circle, the above methods include:

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