Direct dry-film adhering process for hollowed-out region of hollowed-out flexible circuit board

A flexible circuit board and dry film sticking technology, which is applied in the secondary treatment of printed circuits, the removal of conductive materials by chemical/electrolytic methods, and the application of non-metallic protective layers. pollution, etc.

Active Publication Date: 2019-05-03
福建世卓电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method requires an additional printing ink process, and it is also easy to cause board surfac

Method used

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  • Direct dry-film adhering process for hollowed-out region of hollowed-out flexible circuit board
  • Direct dry-film adhering process for hollowed-out region of hollowed-out flexible circuit board
  • Direct dry-film adhering process for hollowed-out region of hollowed-out flexible circuit board

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Embodiment Construction

[0020] In order to illustrate the technical solution of the present invention more clearly, the accompanying drawings that need to be used in the description will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. As far as people are concerned, other embodiments can also be obtained according to these drawings on the premise of not paying creative work.

[0021] The present invention comprises the steps:

[0022] First, use a CNC drilling machine to drill out the pre-set positioning holes on the cover film 2 and pure copper foil 1, and open the window and hollow out the cover film according to the required position of the pad 5, and then according to the position on the cover film 2 and copper foil 1, The positioning holes are aligned and bonded with an alignment jig, and then laminated and cured to obtain a semi-finished copper-clad flexible board 3 formed by opening a window at a...

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PUM

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Abstract

The invention provides a direct dry-film adhering process for a hollowed-out region of a hollowed-out flexible circuit board. The direct dry-film adhering process is characterized by comprising the steps of: A, acquiring a semi-finished copper-clad flexible board; B, selecting a dry film with the thickness of a photosensitive emulsion layer greater than that of a cover film; C, heating double sides of the semi-finished copper-clad flexible board separately, and then adhering dry films on the double sides; D, allowing the semi-finished copper-clad flexible board adhered with the dry films to standby, pushing the semi-finished copper-clad flexible board into an oven for baking, and allowing the semi-finished copper-clad flexible board to standby after baking; E, aligning the semi-finished copper-clad flexible board obtained in the step D by using a film, wherein the exposed part of photosensitive emulsion completes polymerization and film hardening after being exposed to ultraviolet light, the unexposed part is developed to expose copper foil, the exposed copper foil is etched away and then the dry films of the film hardening part is removed to obtain the flexible circuit board. Thedirect dry-film adhering process eliminates the process defect that the hollowed-out flexible circuit board needs to print printing oil in the hollowed-out region and then be adhered with the dry films, reduces the cost, improves the production efficiency, and reduces the printing ink pollution.

Description

technical field [0001] The invention relates to a flexible circuit board processing technology. Background technique [0002] The general manufacturing process of the hollowed-out flexible circuit board is to first use the CNC drilling machine to drill the pre-set positioning holes on the cover film and pure copper foil, and open the window and hollow out the cover film according to the required pad position, and then according to the The positioning holes on the cover film and copper foil are aligned and bonded with an alignment jig, and then laminated and cured to make it a semi-finished copper clad laminate with solder pads or gold finger windows on the cover film surface, and then carry out For the production of the front circuit, when making the front circuit, it is necessary to print photosensitive ink on the hollow part of the cover film on the surface, and then paste the dry film on the front and back after baking. , the pads or gold fingers on this surface are not ...

Claims

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Application Information

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IPC IPC(8): H05K3/28H05K3/06
Inventor 杨贤伟叶华
Owner 福建世卓电子科技有限公司
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