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Scribing method and dividing method

A scribing wheel and scribing line technology, used in glass cutting devices, glass manufacturing equipment, stone processing tools, etc., can solve problems such as breakage, substrate cracking, and reducing the strength of glass substrates

Inactive Publication Date: 2019-05-07
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, when the scribe line is formed at the positions directly above and directly below the sealing material, especially when the thickness of the glass substrate is as thin as 0.4 mm or less, there is a problem that cracks cannot be sufficiently processed on both glass substrates. Confirmed by the inventor of the present application
When the breaking process is performed with insufficient cracks in this way, fine cracks and breakages may occur at the edge of the broken substrate, thereby reducing the strength of the glass substrate.

Method used

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  • Scribing method and dividing method
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  • Scribing method and dividing method

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0040] figure 2 (a) to (c) are diagrams illustrating the scribing method according to the first embodiment. figure 2 (a) is a schematic view of the vicinity of the marking position viewed from the negative side of the Y-axis, figure 2 (b) is a schematic view of the vicinity of the marking position viewed from the positive side of the X-axis, figure 2 (c) is a schematic view of the vicinity of the scribed position viewed from the positive side of the Z-axis.

[0041] Such as figure 2As shown in (a), in this scribing method, the cutting edge angle θ1 of the scribing wheel 301 of the scribing head 2 on the upper side (the positive side of the Z axis) is different from the angle θ1 of the scribing head 2 on the lower side (the negative side of the Z axis). The cutting edge angle θ2 of the scoring wheel 401 is different, and the cutting edge angle θ2 is larger than the cutting edge angle θ1. Specifically, the cutting edge angle θ2 of the scoring wheel 401 is greater than t...

Embodiment approach 2

[0065] In the marking method (marking method 1) in the above-mentioned embodiment, the marking wheel 301 on the positive side of the Z axis is the same as the marking wheel 401 on the negative side of the Z axis in the marking direction (positive direction of the X axis). The position is marked. In other words, the scribing wheels 301 and 401 move toward each other with the motherboard G interposed therebetween. In contrast, in Embodiment 2, the two scoring wheels 301 and 401 are moved so that the scoring wheel 301 is ahead of the scoring wheel 401 by a distance W1 in the scoring direction (X-axis positive direction).

[0066] Figure 6 (a) and (b) are figures explaining Embodiment 2. FIG. Figure 6 (a) is a schematic view of the vicinity of the marking position viewed from the negative side of the Y-axis, Figure 6(b) is a schematic diagram of the vicinity of the scribed position viewed from the X-axis positive side.

[0067] In the second embodiment, in the same manner a...

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Abstract

The invention provides a scribing method and a dividing method, capable of forming a crack having a sufficient depth on a substrate in the case where a scribe line is formed at a position directly above and below the sealing material. When the scribe line is formed on the mother substrate (G) obtained by bonding the two glass substrates (G1) and (G2) by the sealing material (SL), a scriber wheel (301) is pressed against the glass substrate (G1). At the position of the surface facing the sealing material (SL), the scriber wheel (301) is moved along the sealing material (SL), and in parallel with this, the blade angle is larger than that of the scriber wheel (301). A scriber wheel (401) presses the surface of the glass substrate (G2) to move the scriber wheel (401) along the sealing material(SL).

Description

technical field [0001] The present invention relates to a scribing method for forming scribed lines on a substrate and a dividing method for dividing a substrate on which scribed lines have been formed. Background technique [0002] Conventionally, division of a brittle material substrate such as a glass substrate is performed by a scribing step of forming scribed lines on the substrate surface and a breaking step of applying a predetermined force to the substrate surface along the formed scribed lines. In the scribing step, the tip of the scribing wheel moves along a predetermined line while being pressed against the substrate surface. For the formation of the scribe lines, a scribing device having a scribing head was used. [0003] Patent Document 1 below describes a method for cutting out a liquid crystal panel from a mother substrate. In this method, a substrate on which a thin film transistor (TFT) is formed and a substrate on which a color filter (CF) is formed are b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/027C03B33/07C03B33/033B28D1/22
CPCC03B33/033C03B33/037Y02P40/57
Inventor 朱江舩木清二郎
Owner MITSUBOSHI DIAMOND IND CO LTD