Substrate coating facility
A technology for coating equipment and substrates, applied in the field of substrate coating equipment, can solve the problems of low film formation rate, high coating temperature and high equipment cost, and achieve the effect of avoiding damage
Active Publication Date: 2019-05-10
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology
[0005] The purpose of the present invention is to provide a substrate coating equipment, which can effectively solve the problems of low film formation rate, high equipment cost and high coating temperature.
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[0035] The following description of various embodiments is made with reference to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as up, down, front, back, left, right, inside, outside, side, etc., are only directions referring to the drawings. The component names mentioned in the present invention, such as first, second, etc., are only used to distinguish different components, which can be better expressed. In the figures, structurally similar elements are denoted by the same reference numerals.
[0036] Embodiments of the present invention will be described in detail herein with reference to the accompanying drawings. This invention may be embodied in many different forms and should not be construed as only the specific embodiments set forth herein. These embodiments are provided to explain the practical application of the invention, so that others skilled i...
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The invention provides a substrate coating facility. The substrate coating facility comprises a cavity, a carrying substrate, a heat absorption plate and at least one heat dissipation system. A guiderail is arranged in the cavity. The carrying substrate is movably arranged on the guide rail and used for carrying a substrate. The heat absorption plate is arranged on the carrying substrate in a separable mode, comprises a loading side which faces the carrying substrate, and is used for bearing the substrate and absorbing the heat of the substrate. The heat dissipation systems are arranged in the cavity and used for conducting heat dissipation on the heat absorption plate. According to the substrate coating facility, a conventional cooling system is divided into a heat absorption portion anda heat dissipation portion, and the heat absorption portion and the heat dissipation portion are separated. Meanwhile, heat absorption plate supporting columns which are elastically arranged are additionally arranged on the carrying substrate, an existing substrate clamp is replaced by the heat absorption plate, the substrate is processed in a whole-face press fit mode, and therefore the problemthat due to the fact that a large opening mask plate is used for achieving film forming at present, the shadow exists is solved.
Description
technical field [0001] The invention relates to substrate coating equipment. Background technique [0002] Line sputtering coating machine is widely used in the coating process of touch panel (TP), LCD and OLED. Many film forming processes require low temperature, such as TP's On-cell technology and OLED cathode coating by sputtering. In cell refers to the method of embedding touch panel functions into liquid crystal pixels. The integration of touch panel and liquid crystal panel includes "In-cell" method and "On-cell" method. On-cell refers to the method of embedding the touch panel function between the color filter substrate and the polarizer. [0003] Since the organic film layer has been coated on the substrate before sputtering the cathode, the cathode coating generally requires the substrate temperature to be lower than 80°C. In the sputtering coating process, the film layer will accumulate heat on the substrate during the deposition process, which will cause the su...
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IPC IPC(8): C23C14/35C23C14/04C23C14/50
Inventor 谭伟
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD