An ultra-thin heat pipe

Abstract

The invention discloses an ultra-thin heat pipe which comprises a shell, a steam cavity and a porous wick; a working medium is filled in the steam cavity; the ultra-thin heat pipe is provided with a condensation section, an evaporation section and a heat insulation section; the porous wicks include fractal cascade porous wicks and sparse porous wicks; the fractal cascade porous wicks are arrangedon the inner walls of the evaporation section and the condensation section; the sparse porous wicks are arranged on the inner wall of the heat insulation surface; and the fractal cascade porous wicksare formed by arranging m fractal cascade micro-groove units which are arranged on the shell in parallel. By arranging the fractal cascade porous wicks, the ultra-thin heat pipe provided by the invention has the advantages of strong capillary force, low flow resistance and large heat transfer capacity, can efficiently lower the temperature of a local heat source and improves the working reliability and the stability of a microelectronic device.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic equipment, in particular to an ultra-thin heat pipe applied to heat dissipation of microelectronic devices in a confined space. Background technique [0002] Moore's Law states that the performance of electronic products doubles every 18 months. Therefore, the power consumption of the chip must increase accordingly, and the heat consumption generated is also increasing. At the same time, with the development of micro-electronic machinery, more and more electronic components are packaged in tiny spaces. This has resulted in increasing heat consumption of electronic devices, but the package size is getting smaller and smaller, so the heat flux density per unit area and unit volume is getting higher and higher. Research and practical applications show that 55% of electronic equipment failures are caused by overheating, and the reliability of the system will decrease by 50% for every 10...

AI Technical Summary

Problems solved by technology

However, due to the ultra-thin nature of the ultra-thin heat pipe, the fluid flow and heat transport are restricted, which limits its heat transfer performance.

It is mainly manifested in the large flow resistance of the working liquid, the small space for steam circulation, and the weak capillary driving force, especially the lack of synergistic optimization of capillary phase change heat transfer and flow resistance, which leads to the inability to quickly diffuse heat, the decrease of the maximum heat transfer capacity and the thermal resistance. larger

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