Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing process of hollow flexible circuit board of new energy vehicle

A technology for flexible circuit boards and new energy vehicles, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, and can solve problems such as affecting the performance of flexible circuit boards, poor solution etching accuracy, and poor hollow molding accuracy. The etching time is short, the precision is easy to control, and the effect of improving the scale

Active Publication Date: 2019-05-10
常州市武进三维电子有限公司
View PDF12 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Regardless of the method, the forming efficiency is low, and the current processing method, the solution etching accuracy is poor, and the hollow forming accuracy is poor, which affects the performance of the flexible circuit board.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The manufacturing process of the hollow flexible circuit board of the new energy vehicle includes the following steps:

[0026] S1. Prepare materials, cut the copper foil with polyimide base film according to the design size, and obtain the copper foil base film;

[0027] S2. Paste dry film, use dry film pasting equipment to paste a layer of dry film on the copper surface of the obtained copper foil base film, control the air pressure 0.4MPa, temperature 115 ° C, and conveying speed 2.5-3.5m / min in the dry film , the speed of transmission matches the air pressure and temperature, which promotes the high efficiency of film attachment, greatly reduces the probability of air bubbles, copper leakage, and wrinkles, and the quality of dry film paste is high, which promotes the improvement of the finished product quality of flexible circuit boards;

[0028] S3. Exposure: use an exposure machine to expose the copper foil base film with a dry film, and then transfer the circuit ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of flexible circuit boards, and particularly relates to a manufacturing process of a hollow flexible circuit board of a new energy vehicle. The manufacturing process of the hollow flexible circuit board of the new energy vehicle comprises the following steps: 1) forming a circuit on a copper foil of a copper foil plate of a base film; 2) printing ink onthe copper foil and the base film; 3) etching a hollow rudiment on the base film by using laser etching, and the copper is not exposed at the hollow rudiment after the laser etching; and 4) etching the location of the hollow rudiment with an etching solution. The efficiency of the hollow forming is high, the precision is high, and the using performance of the flexible circuit board is improved.

Description

technical field [0001] The invention belongs to the technical field of flexible circuit boards, and in particular relates to a manufacturing process of hollow flexible circuit boards for new energy vehicles. Background technique [0002] The hollowed out flexible circuit board refers to the hollowing out on the back of the base film of the flexible circuit board. At present, the production method disclosed in the prior art is to etch the PI layer after etching the circuit using the traditional process of light copper foil. The specific steps are: material cutting → drilling → pretreatment → dry film application → exposure → development → copper etching Layer → stripping → dry film again → exposure again → development again → etching the PI layer → post-processing → stripping again → surface treatment → pasting and encapsulation; or use the treatment method of etching the PI layer first and then making the circuit. Regardless of the method, the forming efficiency is low, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/06
Inventor 侯晓明徐建华侯燕芬张素安
Owner 常州市武进三维电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com